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型号： MPC8379E-MDS-PB
厂商： Freescale Semiconductor
文件页数： 19/117页
文件大小： 0K
描述： BOARD PROCESSOR FOR MDS S
标准包装： 1
系列： PowerQUICC II™ PRO
类型： MPU
适用于相关产品： MPC8379
所含物品： 板
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
115
5
07/2011
In Table 2, “Absolute Maximum Ratings1,” removed footnote 5 from LBIN to OVIN. Also, corrected
footnote 5.
In Table 3, “Recommended Operating Conditions,” added footnote 2 to AVDD.
In Figure 2, “Overshoot/Undershoot Voltage for GVDD/LVDD/OVDD/LBVDD,” added LBVDD.
In Table 13, “DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V,” updated IOZ min/max
to –50/50.
In Figure 11, “RGMII and RTBI AC Timing and Multiplexing Diagrams,” added distinction between
tSKRGT_RX and tSKRGT_TX signals.
In Table 33, “MII Management AC Timing Specifications,” updated MDC frequency—removed Min and
Max values, added Typical value. Also, updated footnote 2 and removed footnote 3.
In Table 48, “PCI DC Electrical Characteristics,” updated VIH min value to 2.0.
In Table 69, “TePBGA II Pinout Listing,” added Note to LGPL4/LFRB_B/LGTA_B/LUPWAIT/LPBSE (to
be consistent with AN3665, “MPC837xE Design Checklist.”
In Table 71, “Operating Frequencies for TePBGA II,” added Minimum Operating Frequency for eTSEC,
and corrected DDR2 Minimum and Maximum Operating Frequency values.
4
11/2010
In Table 25, “RGMII and RTBI DC Electrical Characteristics,” updated VIH min value to 1.7.
In Table 40, “Local Bus General Timing Parameters—PLL Bypass Mode,” added row for tLBKHLR.
In Section 10.2, “Local Bus AC Electrical Specifications,” and in Section 22, “Clocking,” updated LCCR
to LCRR.
In Table 69, “TePBGA II Pinout Listing,” added SD_WP to pin C9. Also clarified TEST_SEL0 and
TEST_SEL1 pins—no change in functionality.
3
03/2010
Added Section 4.3, “eTSEC Gigabit Reference Clock Timing.”
In Table 34, “USB DC Electrical Characteristics,” and Table 35, “USB General Timing Parameters (ULPI
Mode Only),” added table footnotes .
In Table 39, “Local Bus General Timing Parameters—PLL Enable Mode,” and Table 40, “Local Bus
General Timing Parameters—PLL Bypass Mode,” corrected footnotes for tLBOTOT1, tLBOTOT2, tLBOTOT3.
In Figure 22, “Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 2 (PLL Enable Mode),” and
Figure 24, “Local Bus Signals, GPCM/UPM Signals for LCRR[CLKDIV] = 4 (PLL Enable Mode),” shifted
“Input Signals: LAD[0:31]/LDP[0:3]” from the falling edge to the rising edge of LSYNC_IN.
In Figure 60, “Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II,” added
heat spreader.
In Section 24.6, “Pull-Up Resistor Requirements,” removed “Ethernet Management MDIO pin” from list
of open drain type pins.
In Table 69, “TePBGA II Pinout Listing,” updated the Pin Type column for AVDD_C, AVDD_L, and
AVDD_P pins.
in Table 69, “TePBGA II Pinout Listing,” added Note 17 to eTSEC pins.
In Table 74, “CSB Frequency Options for Host Mode,” and Table 75, “CSB Frequency Options for Agent
Mode,” updated
csb_clk frequencies available.
In Table 81, “Part Numbering Nomenclature,” removed footnote to “e300 core Frequency.”
Table 84. Document Revision History (continued)
Revision
Date
Substantive Change(s)
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