参数资料
型号: MPC8544EAVTAQGA
厂商: Freescale Semiconductor
文件页数: 80/117页
文件大小: 0K
描述: IC MPU POWERQUICC III 783-FCBGA
标准包装: 36
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
封装/外壳: 783-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
Freescale Semiconductor
65
High-Speed Serial Interfaces (HSSI)
Figure 44. Differential Voltage Definitions for Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5 V and 2.0 V. Using these values, the peak-to-peak voltage swing of each signal (TD
or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, since
the differential signaling environment is fully symmetrical, the transmitter output’s differential swing
(VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges
between 500 mV and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other
phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p)
is 1000 mV p-p.
16.2
SerDes Reference Clocks
The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by
the corresponding SerDes lanes. The SerDes reference clocks inputs are SD1_REF_CLK and
SD1_REF_CLK for PCI Express1, PCI Express2. SD2_REF_CLK, and SD2_REF_CLK for the PCI
Express3 or SGMII interface, respectively. The following sections describe the SerDes reference clock
requirements and some application information.
16.2.1
SerDes Reference Clock Receiver Characteristics
Figure 45 shows a receiver reference diagram of the SerDes reference clocks.
The supply voltage requirements for XVDD_SRDS2 are specified in Table 1 and Table 2.
SerDes reference clock receiver reference circuit structure
— The SDn_REF_CLK and SDn_REF_CLK are internally AC-coupled differential inputs as
shown in Figure 45. Each differential clock input (SDn_REF_CLK or SDn_REF_CLK) has a
50-
Ωtermination to SGND_SRDSn (xcorevss) followed by on-chip AC-coupling.
— The external reference clock driver must be able to drive this termination.
Differential Swing, VID or VOD = A – B
A Volts
B Volts
SDn_TX or
SDn_RX
SDn_TX or
SDn_RX
Differential Peak Voltage, VDIFFp = |A – B|
Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown)
Vcm = (A + B) / 2
相关PDF资料
PDF描述
MPC8544EAVTANGA IC MPU POWERQUICC III 783-FCBGA
MPC8544EAVTALFA IC MPU POWERQUICC III 783-FCBGA
SLW5S-5C7LF CONN ZIF CIC 5POS DIP 1MM VERT
XF2L-0735-1A CONNECTOR FPC 7POS 0.5MM SMD
XF2L-0725-1A CONN FPC 7POS 0.5MM PITCH SMD
相关代理商/技术参数
参数描述
MPC8544EAVTARJ 功能描述:微处理器 - MPU PQ3 8544E Netwrk Comm Indstrl Cntrl RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8544EAVTARJA 功能描述:数字信号处理器和控制器 - DSP, DSC PQ38K 8544E RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8544ECVTALF 功能描述:微处理器 - MPU PQ38K 8544E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8544ECVTALFA 功能描述:数字信号处理器和控制器 - DSP, DSC PQ38K 8544E COMMERCIAL RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8544ECVTANG 功能描述:微处理器 - MPU PQ38K 8544E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324