参数资料
型号: MPC8572CPXAUNB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1333 MHz, MICROPROCESSOR, PBGA1023
封装: 33 X 33 MM, PLASTIC, FCBGA-1023
文件页数: 33/138页
文件大小: 1502K
代理商: MPC8572CPXAUNB
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
128
Freescale Semiconductor
System Design Information
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 66. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion will
give unpredictable results.
The following pins must NOT be pulled down during power-on reset: DMA_DACK[0:1], EC5_MDC,
HRESET_REQ, TRIG_OUT/READY_P0/QUIESCE, MSRCID[2:4], MDVAL, and ASLEEP. The
TEST_SEL pin must be set to a proper state during POR configuration. Please refer to the pinlist table of
the individual device for more details.
21.7
Output Buffer DC Impedance
The MPC8572E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 64). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
Figure 64. Driver Impedance Measurement
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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