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| 型号： | MR25H40CDF |
| 厂商： | Everspin Technologies Inc |
| 文件页数： | 4/19页 |
| 文件大小： | 0K |
| 描述： | IC MRAM 4MBIT 40MHZ 8DFN |
| 标准包装： | 490 |
| 格式 - 存储器： | RAM |
| 存储器类型： | MRAM（磁阻 RAM） |
| 存储容量： | 4M (512K x 8) |
| 速度： | 40MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-VDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN-EP，小标志 (5x6) |
| 包装： | 托盘 |
| 其它名称： | 819-1040 |
MR25H40
2. SPI COMMUNICATIONS PROTOCOL
MR25H40 can be operated in either SPI Mode 0 (CPOL=0, CPHA =0) or SPI Mode 3 (CPOL=1, CPHA=1). For
both modes, inputs are captured on the rising edge of the clock and data outputs occur on the falling
edge of the clock. When not conveying data, SCK remains low for Mode 0; while in Mode 3, SCK is high. The
memory determines the mode of operation (Mode 0 or Mode 3) based upon the state of the SCK when CS
falls.
All memory transactions start when CS is brought low to the memory. The first byte is a command code. De-
pending upon the command, subsequent bytes of address are input. Data is either input or output. There
is only one command performed per CS active period. CS must go inactive before another command can
be accepted. To ensure proper part operation according to specifications, it is necessary to terminate each
access by raising CS at the end of a byte (a multiple of 8 clock cycles from CS dropping) to avoid partial or
aborted accesses.
Table 2.1 Command Codes
Instruction Description
Binary Code
Hex Code
Address Bytes
Data Bytes
0000 0110
WREN
Write Enable
06h
0
0
WRDI
RDSR
WRSR
READ
WRITE
SLEEP
WAKE
Write Disable
Read Status Register
Write Status Register
Read Data Bytes
Write Data Bytes
Enter Sleep Mode
Exit Sleep Mode
0000 0100
0000 0101
0000 0001
0000 0011
0000 0010
1011 1001
1010 1011
04h
05h
01h
03h
02h
B9h
ABh
0
0
0
3
3
0
0
0
1
1
1 to ∞
1 to ∞
0
0
Status Register
The status register consists of the 8 bits listed in table 2.2. As seen in table 2.3, the Status Register Write
Disable bit (SRWD) is used in conjunction with bit 1 (WEL) and the Write Protection pin (WP) to provide
hardware memory block protection. Bits BP0 and BP1 define the memory block arrays that are protected
as described in table 2.4. The fast writing speed of MR25H40 does not require write status bits. The state of
bits 6,5,4, and 0 can be user modified and do not affect memory operation. All bits in the status register
are pre-set from the factory in the “0” state.
Table 2.2 Status Register Bit Assignments
Bit 7
SRWD
Bit 6
Don’t Care
Bit 5
Don’t Care
Bit 4
Don’t Care
Bit 3
BP1
Bit 2
BP0
Bit 1
WEL
Bit 0
Don’t Care
Everspin Technologies ? 2011
4
MR25H40 Rev. 5, 11/2011
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| MR25H40CDFR | 功能描述:NVRAM 4Mb 3.3V 512Kx8 SPI RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H40MDC | 功能描述:NVRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H40MDCR | 功能描述:NVRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H40MDF | 功能描述:NVRAM 4Mb 3.3V 512Kx8 SPI Pre-Qual Sample MRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
| MR25H40MDFR | 功能描述:NVRAM 4Mb 3.3V 512Kx8 SPI Pre-Qual Sample MRAM RoHS:否 制造商:Maxim Integrated 数据总线宽度:8 bit 存储容量:1024 Kbit 组织:128 K x 8 接口类型:Parallel 访问时间:70 ns 电源电压-最大:5.5 V 电源电压-最小:4.5 V 工作电流:85 mA 最大工作温度:+ 70 C 最小工作温度:0 C 封装 / 箱体:EDIP 封装:Tube |
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