参数资料
型号: MSC8101VT1250F
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 数字信号处理
英文描述: 64-BIT, 62.5 MHz, OTHER DSP, PBGA332
封装: 17 X 17 MM, LIDDED FLIP CHIP, PLASTIC, BGA-332
文件页数: 104/104页
文件大小: 1811K
代理商: MSC8101VT1250F
MSC8101 Technical Data, Rev. 18
Freescale Semiconductor
4-1
Design Considerations
4
This chapter includes design and layout guidelines for manufacturing boards using the MSC8102.
4.1 Thermal Design Considerations
The average chip-junction temperature, TJ, in ° C can be obtained from the following:
TJ = TA + (PD θJA)
Equation 1
where
TA = ambient temperature ° C
θ
JA = package thermal resistance, junction to ambient, ° C/W
PD = PINT + PI/O in W
PINT = IDD × VDD in W—chip internal power
PI/O = power dissipation on output pins in W—user determined
The user should set TA and PD such that TJ does not exceed the maximum operating conditions. In case TJ is too
high, the user should either lower the ambient temperature or the power dissipation of the chip.
The input voltage must not exceed the I/O supply VDDH by more than 2.5 V at any time, including during power-on
reset. In turn, VDDH can exceed VDD/VCCSYN by more than 3.3 V during power-on reset, but for no more than 100 ms.
VDDH should not exceed VDD/VCCSYN by more than 2.1 V during normal operation. VDD/VCCSYN must not exceed VDDH
by more than 0.4 V at any time, including during power-on reset. Therefore the recommendation is to use
“bootstrap” diodes between the power rails, as shown in Figure 4-1.
Figure 4-1.
Bootstrap Diodes for Power-Up Sequencing
I/O Power
Core/PLL
Supply
MUR420
3.3 V (VDDH)
1.6 V (VDD/VCCSYN)
相关PDF资料
PDF描述
MSC8101VT1500F 64-BIT, 75 MHz, OTHER DSP, PBGA332
MSC8101M1375F 64-BIT, 68.75 MHz, OTHER DSP, PBGA332
MSC8126VT8000 0-BIT, 500 MHz, OTHER DSP, PBGA431
MSC8126TMP6400 0-BIT, 400 MHz, OTHER DSP, PBGA431
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