参数资料
型号: MSP430F2370TRHAR
厂商: Texas Instruments
文件页数: 10/65页
文件大小: 0K
描述: IC MCU 16BIT 32K FLASH 40-QFN
产品培训模块: The Ultra-Low Power MSP430
MSP430 Overview
MSP430 Design Tools
MSP430 Peripherals
MSP430x2xx/4xx and Wireless Overview
Portable Medical Solutions with MSP430
MSP430 for Utility Metering Solutions
MSP430: How to JTAG
MSP430, How To Use the Clock System
Grace Software Graphical User Interface
MCU Overview
Driver Library
MSP430Ware Overview
标准包装: 2,500
系列: MSP430F2xx
核心处理器: RISC
芯体尺寸: 16-位
速度: 16MHz
连通性: I²C,IrDA,LIN,SCI,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 32
程序存储器容量: 32KB(32K x 8 + 256B)
程序存储器类型: 闪存
RAM 容量: 2K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 3.6 V
数据转换器: 斜率 A/D
振荡器型: 内部
工作温度: -40°C ~ 105°C
封装/外壳: 40-VFQFN 裸露焊盘
包装: 带卷 (TR)
配用: 296-23115-ND - TOOL FLASH EMU MSP430 40PIN RHA
4.15 MHz
12 MHz
16 MHz
1.8 V
2.2 V
2.7 V
3.3 V
3.6 V
Supply Voltage V
System
Frequency
MHz
Supply voltage range
during flash memory
programming
Supply voltage range
during program execution
Legend :
7.5 MHz
MSP430F23x0
SLAS518E
– AUGUST 2006 – REVISED AUGUST 2011
Absolute Maximum Ratings
(1)
Voltage applied at VCC to VSS
-0.3 V to 4.1 V
Voltage applied to any pin (2)
-0.3 V to (VCC + 0.3 V)
Diode current at any device terminal
±2 mA
Unprogrammed device
-55
°C to 150°C
Storage temperature, Tstg
(3)
Programmed device
-55
°C to 150°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
(3)
Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
(1)
MIN
MAX
UNIT
During program execution
1.8
3.6
VCC
Supply voltage(2), AVCC = DVCC = VCC
V
During flash memory programming
2.2
3.6
VSS
Supply voltage, AVSS = DVSS = VSS
0
V
I version
-40
85
TA
Operating free-air temperature
°C
T version
-40
105
VCC = 1.8 V, Duty cycle = 50% ±10%
dc
4.15
Processor frequency (maximum MCLK frequency)(1)(3)
fSYSTEM
VCC = 2.7 V, Duty cycle = 50% ±10%
dc
12
MHz
(see Figure 1)
VCC ≥ 3.3 V, Duty cycle = 50% ±10%
dc
16
(1)
Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
(2)
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power-up.
(3)
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC
of 2.2 V.
Figure 1. Operating Area
18
Copyright
2006–2011, Texas Instruments Incorporated
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