- 您现在的位置：买卖IC网 > PDF目录11506 > MSP430F2370TRHAR (Texas Instruments)IC MCU 16BIT 32K FLASH 40-QFN PDF资料下载
参数资料
| 型号： | MSP430F2370TRHAR |
| 厂商： | Texas Instruments |
| 文件页数： | 57/65页 |
| 文件大小： | 0K |
| 描述： | IC MCU 16BIT 32K FLASH 40-QFN |
| 产品培训模块： | The Ultra-Low Power MSP430 MSP430 Overview MSP430 Design Tools MSP430 Peripherals MSP430x2xx/4xx and Wireless Overview Portable Medical Solutions with MSP430 MSP430 for Utility Metering Solutions MSP430: How to JTAG MSP430, How To Use the Clock System Grace Software Graphical User Interface MCU Overview Driver Library MSP430Ware Overview |
| 标准包装： | 2,500 |
| 系列： | MSP430F2xx |
| 核心处理器： | RISC |
| 芯体尺寸： | 16-位 |
| 速度： | 16MHz |
| 连通性： | I²C，IrDA，LIN，SCI，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，POR，PWM，WDT |
| 输入/输出数： | 32 |
| 程序存储器容量： | 32KB（32K x 8 + 256B） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 2K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.8 V ~ 3.6 V |
| 数据转换器： | 斜率 A/D |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 40-VFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 配用： | 296-23115-ND - TOOL FLASH EMU MSP430 40PIN RHA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页当前第57页第58页第59页第60页第61页第62页第63页第64页第65页
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
MSP430F2370TRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
M430
F2370T
MSP430F2370TRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
M430
F2370T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
相关PDF资料 |
PDF描述 |
|---|---|
| VE-B33-CU-F4 | CONVERTER MOD DC/DC 24V 200W |
| VE-B32-CU-F4 | CONVERTER MOD DC/DC 15V 200W |
| PIC32MX210F016DT-I/ML | 32BIT MCU 16KB FLASH 44QFN |
| VE-B32-CU-F3 | CONVERTER MOD DC/DC 15V 200W |
| SST89V516RD2-33-C-TQJE | IC MCU 8BIT 72KB FLASH 44TQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MSP430F2370TRHAT | 功能描述:16位微控制器 - MCU 16-bit Ultra-Lo-Pwr Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430F2410TPM | 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430F2410TPMR | 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430F2410TRGCR | 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430F2410TRGCT | 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
发布紧急采购，3分钟左右您将得到回复。