参数资料
型号: MSP430F2370TRHAR
厂商: Texas Instruments
文件页数: 12/65页
文件大小: 0K
描述: IC MCU 16BIT 32K FLASH 40-QFN
产品培训模块: The Ultra-Low Power MSP430
MSP430 Overview
MSP430 Design Tools
MSP430 Peripherals
MSP430x2xx/4xx and Wireless Overview
Portable Medical Solutions with MSP430
MSP430 for Utility Metering Solutions
MSP430: How to JTAG
MSP430, How To Use the Clock System
Grace Software Graphical User Interface
MCU Overview
Driver Library
MSP430Ware Overview
标准包装: 2,500
系列: MSP430F2xx
核心处理器: RISC
芯体尺寸: 16-位
速度: 16MHz
连通性: I²C,IrDA,LIN,SCI,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 32
程序存储器容量: 32KB(32K x 8 + 256B)
程序存储器类型: 闪存
RAM 容量: 2K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 3.6 V
数据转换器: 斜率 A/D
振荡器型: 内部
工作温度: -40°C ~ 105°C
封装/外壳: 40-VFQFN 裸露焊盘
包装: 带卷 (TR)
配用: 296-23115-ND - TOOL FLASH EMU MSP430 40PIN RHA
MSP430F23x0
SLAS518E
– AUGUST 2006 – REVISED AUGUST 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. Available Options
PACKAGED DEVICES(1)(2)
TA
PLASTIC 49-PIN DSBGA
PLASTIC 40-PIN QFN
(YFF)
(RHA)
MSP430F2330IYFF
MSP430F2330IRHA
-40
°C to 85°C
MSP430F2350IYFF
MSP430F2350IRHA
MSP430F2370IYFF
MSP430F2370IRHA
-
MSP430F2330TRHA
-40
°C to 105°C
-
MSP430F2350TRHA
-
MSP430F2370TRHA
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Development Tool Support
All MSP430 microcontrollers include an Embedded Emulation Module (EEM) that allows advanced debugging
and programming through easy-to-use development tools. Recommended hardware options include:
Debugging and Programming Interface with Target Board
– MSP-FET430U23X0 (RHA package)
Debugging and Programming Interface
– MSP-FET430UIF (USB)
– MSP-FET430PIF (Parallel Port)
Target Board
– MSP-TS430QFN23X0 (RHA package)
Production Programmer
– MSP-GANG430
2
Copyright
2006–2011, Texas Instruments Incorporated
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相关代理商/技术参数
参数描述
MSP430F2370TRHAT 功能描述:16位微控制器 - MCU 16-bit Ultra-Lo-Pwr Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2410TPM 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2410TPMR 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2410TRGCR 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2410TRGCT 功能描述:16位微控制器 - MCU 16B Ultra-Lo-Pwr MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT