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参数资料
| 型号： | MT41J512M4JE-187EIT:A |
| 元件分类： | DRAM |
| 英文描述： | 64M X 4 DDR DRAM, PBGA82 |
| 封装： | 12.50 X 15 MM, LEAD FREE, FBGA-82 |
| 文件页数： | 3/11页 |
| 文件大小： | 288K |
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property
of their respective owners.
Advance: This data sheet contains initial descriptions of products still under development.
2Gb: x4, x8 DDR3 SDRAM
Package Dimensions
PDF: 09005aef826aaadc/Source: 09005aef826a65af
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2Gb DDR3 SDRAM.fm - Rev. C 12/07 EN
11
2006 Micron Technology, Inc. All rights reserved.
Advance
Package Dimensions
Figure 7:
82-Ball FBGA – 12.5mm x 15mm (x4, x8)
Notes:
1. All dimensions in millimeters.
2. Number of outriggers subject to change.
Ball A1 ID
0.75 ±0.05
Seating
plane
0.10 A
A
1.20 MAX
0.80
TYP
0.80 TYP
4.00
8.00
12.50 ±0.10
6.25 ±0.05
82X 0.45
Solder ball material: 96.5% Sn, 3% Ag, 0.5% Cu
Mold compound: epoxy novolac
Substrate material: plastic laminate
9.60
4.80
7.50 ±0.05
15.00 ±0.10
Ball A1 ID
Dimensions apply
to solder balls
post reflow. Pre-
reflow ball is
0.42 on a 0.33
NSMD ball pad.
11 10 9
8
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MT41J512M4V79D3WC1 | 制造商:Micron Technology Inc 功能描述:512MX4 DDR3 SDRAM DIE-COM COMMERCIAL 1.5V - Trays |
| MT41J512M4V89C3WC1 | 制造商:Micron Technology Inc 功能描述:512MX4 DDR3 SDRAM DIE-COM COMMERCIAL 1.5V - Bulk |
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