参数资料
型号: NAND04GW4B3BN1F
厂商: STMICROELECTRONICS
元件分类: PROM
英文描述: 256M X 16 FLASH 3V PROM, 35 ns, PDSO48
封装: 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48
文件页数: 57/59页
文件大小: 998K
代理商: NAND04GW4B3BN1F
7/59
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
SUMMARY DESCRIPTION
The NAND Flash 2112 Byte/ 1056 Word Page is a
family of non-volatile Flash memories that uses
NAND cell technology. The devices range from
512 Mbits to 8 Gbits and operate with either a 1.8V
or 3V voltage supply. The size of a Page is either
2112 Bytes (2048 + 64 spare) or 1056 Words
(1024 + 32 spare) depending on whether the de-
vice has a x8 or x16 bus width.
The address lines are multiplexed with the Data In-
put/Output signals on a multiplexed x8 or x16 In-
put/Output bus. This interface reduces the pin
count and makes it possible to migrate to other
densities without changing the footprint.
Each block can be programmed and erased over
100,000 cycles. To extend the lifetime of NAND
Flash devices it is strongly recommended to imple-
ment an Error Correction Code (ECC).
The devices have hardware and software security
features:
A Write Protect pin is available to give a
hardware protection against program and
erase operations.
A Block Locking scheme is available to
provide user code and/or data protection.
The devices feature an open-drain Ready/Busy
output that can be used to identify if the Program/
Erase/Read (P/E/R) Controller is currently active.
The use of an open-drain output allows the Ready/
Busy pins from several memories to be connected
to a single pull-up resistor.
A Copy Back Program command is available to
optimize the management of defective blocks.
When a Page Program operation fails, the data
can be programmed in another page without hav-
ing to resend the data to be programmed.
Each device has Cache Program and Cache Read
features which improve the program and read
throughputs for large files. During Cache Program-
ming, the device loads the data in a Cache Regis-
ter while the previous data is transferred to the
Page Buffer and programmed into the memory ar-
ray. During Cache Reading, the device loads the
data in a Cache Register while the previous data
is transferred to the I/O Buffers to be read.
All devices have the Chip Enable Don’t Care fea-
ture, which allows code to be directly downloaded
by a microcontroller, as Chip Enable transitions
during the latency time do not stop the read oper-
ation.
Two options are available for the NAND Flash
2112 Byte/ 1056 Word Page family:
Automatic Page 0 Read at Power-up, which
allows the microcontroller to directly download
the boot code from page 0.
A Unique Identifier (serial number), which
allows each device to be uniquely identified.
The Unique Identifier options is subject to an NDA
(Non Disclosure Agreement) and so not described
in the datasheet. For more details of this option
contact your nearest ST Sales office.
The devices are available in the following packag-
es:
TSOP48 (12 x 20mm) for all products
USOP48 (12 x 17 x 0.65mm) for 512Mb
and1Gb products
VFBGA63 (9.5 x 12 x 1mm, 0.8mm pitch) for
512Mb and 1Gb products
TFBGA63 (9.5 x 12 x 1.2mm, 0.8mm pitch) for
2Gb Dual Die products
LFBGA63 (9.5 x 12 x 1.4mm, 0.8mm pitch) for
8Gb Quadruple Die products.
For information on how to order these options refer
vices are shipped from the factory with Block 0 al-
ways valid and the memory content bits, in valid
blocks, erased to ’1’.
See Table 2., Product Description, for all the de-
vices available in the family.
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