参数资料
型号: NAND08GW3B3AZB6F
厂商: NUMONYX
元件分类: PROM
英文描述: 1G X 8 FLASH 3V PROM, 25000 ns, PBGA63
封装: 9.50 X 12 MM,1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-63
文件页数: 39/59页
文件大小: 1154K
代理商: NAND08GW3B3AZB6F
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
44/59
Table 25. AC Characteristics for Operations
Note: 1. The time to Ready depends on the value of the pull-up resistor tied to the Ready/Busy pin. See Figures 35, 36 and 37.
2. To break the sequential read cycle, E must be held High for longer than tEHEL.
3. ES = Electronic Signature.
Symbol
Alt.
Symbol
Parameter
1.8V
Devices
3V
Devices
Unit
tALLRL1
tAR
Address Latch Low to
Read Enable Low
Read Electronic Signature
Min
10
ns
tALLRL2
Read cycle
Min
10
ns
tBHRL
tRR
Ready/Busy High to Read Enable Low
Min
20
ns
tBLBH1
Ready/Busy Low to
Ready/Busy High
Read Busy time
Max
25
s
tBLBH2
tPROG
Program Busy time
Max
700
s
tBLBH3
tBERS
Erase Busy time
Max
3
ms
tBLBH4
Reset Busy time, during ready
Max
5
s
tBLBH5
tCBSY
Cache Busy time
Typ
3
s
Max
500
s
tWHBH1
tRST
Write Enable High to
Ready/Busy High
Reset Busy time, during read
Max
5
s
Reset Busy time, during program
Max
10
s
Reset Busy time, during erase
Max
500
s
tCLLRL
tCLR
Command Latch Low to Read Enable Low
Min
10
ns
tDZRL
tIR
Data Hi-Z to Read Enable Low
Min
0
ns
tEHBH
tCRY
Chip Enable High to Ready/Busy High (E intercepted read)
Max
60 + tr
(1)
60 + tr
(1)
ns
tEHEL
tCEH
Chip Enable High to Chip Enable Low(2)
Min
100
ns
tEHQZ
tCHZ
Chip Enable High to Output Hi-Z
Max
20
ns
tELQV
tCEA
Chip Enable Low to Output Valid
Max
45
ns
tRHBL
tRB
Read Enable High to Ready/Busy Low
Max
100
ns
tRHRL
tREH
Read Enable High to
Read Enable Low
Read Enable High Hold time
Min
20
ns
tRHQZ
tRHZ
Read Enable High to Output Hi-Z
Min
15
ns
Max
30
tRLRH
tRP
Read Enable Low to
Read Enable High
Read Enable Pulse Width
Min
25
ns
tRLRL
tRC
Read Enable Low to
Read Enable Low
Read Cycle time
Min
60
50
ns
tRLQV
tREA
Read Enable Low to
Output Valid
Read Enable Access time
Max
35
ns
Read ES Access time(3)
tWHBH
tR
Write Enable High to
Ready/Busy High
Read Busy time
Max
25
s
tWHBL
tWB
Write Enable High to Ready/Busy Low
Max
100
ns
tWHRL
tWHR
Write Enable High to Read Enable Low
Min
60
ns
tWLWL
tWC
Write Enable Low to
Write Enable Low
Write Cycle time
Min
60
50
ns
相关PDF资料
PDF描述
NAND08GW3B3AZB6 1G X 8 FLASH 3V PROM, 25000 ns, PBGA63
NAND256R3A1BN1F 32M X 8 FLASH 1.8V PROM, 15000 ns, PDSO48
NAND256R3A3BZA6F 32M X 8 FLASH 1.8V PROM, 15000 ns, PBGA63
NAND256R3A3CN1E 32M X 8 FLASH 1.8V PROM, 15000 ns, PDSO48
NAND256R4A1DN1E 16M X 16 FLASH 1.8V PROM, 15000 ns, PDSO48
相关代理商/技术参数
参数描述
NAND08GW3B4BN6E 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND08GW3B4BN6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel
NAND08GW3B4CN1F 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND08GW3B4CZL6E 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND08GW3C2AE01 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel