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参数资料
| 型号： | NAND512R3M0BZBE |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA107 |
| 封装： | 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-107 |
| 文件页数： | 13/22页 |
| 文件大小： | 200K |
| 代理商： | NAND512R3M0BZBE |
Part Numbering
NAND256-M, NAND512-M, NAND01G-M
20/22
4
Part Numbering
Devices are shipped from the factory with the Flash memory content bits, in valid blocks,
erased to ’1’. For further information on any aspect of this device, please contact your
nearest ST Sales Office.
Table 9.
Ordering Information Scheme
Example:
NAND256
R
3
M
4
A
ZB
5
E
Device Type
NAND Flash Memory
NAND Flash Density
256 = 256Mb
512 = 512Mb
01G = 1Gb
Operating Voltage
R = VDDF = 1.7V to 1.95V
W = VDDF = 2.5V to 3.6V
NAND Bus Width
3 = x8
4 = x16
Family Identifier
M = 528 Byte Page NAND Flash + LPSDRAM
Device Options
0 = 256, x16, 104MHz, SDR, BGA107
2 = 2 x 256, 2x16, 104MHz, SDR, BGA137
3 = 256, x16, 133MHz, DDR BGA149
4 = 256, x16, 104MHz, SDR, BGA149
5 = 512, x16, 133MHz, DDR, BGA149
Product Version
A
B
C
Package
ZB = TFBGA
ZC = LFBGA
Temperature range
5 = -30°c to 85°C
Option
E = ECOPACK Package, Standard Packing
F = ECOPACK Package, Tape & Reel Packing
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NAND512R4A2CWFD | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512R4A2CZA6 | 制造商:Micron Technology Inc 功能描述:512MB. 3V X8 NO OPTION TSOP48TSOP-1 48 12X20 AL 42 - Trays |
| NAND512R4A2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512W3A0AN6 | 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| NAND512W3A0AN6E | 功能描述:闪存 2.7-3.6V 512M(64Mx8) RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
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