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参数资料
| 型号： | NAND512R3M0BZBE |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA107 |
| 封装： | 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-107 |
| 文件页数： | 20/22页 |
| 文件大小： | 200K |
| 代理商： | NAND512R3M0BZBE |
NAND256-M, NAND512-M, NAND01G-M
Summary description
7/22
LPSDRAM Component
The NAND256-M and NAND512-M devices contain either:
●
one M65KA256AL: 256 Mbit (x16) Single Data Rate (SDR) LPSDRAM
●
two M65KA256AL: 256 Mbit (x16) Single Data Rate (SDR) LPSDRAMs (SDR0 and
SDR1)
●
one M65KG256AF: 256 Mbit (x16) Double Data Rate (DDR) LPSDRAM
●
one M65KG512AB: 512Mbit (x16) double Data Rate (DDR) LPSDRAM
Refer to Table 1: Product List, for a description of the memories contained in the NAND256-
M, NAND256-M and NAND01G-M devices.
For detailed information on how to use the SDR LPSDRAM devices, refer to the
M65KA256AL datasheet which is available from your local STMicroelectronics distributor.
For detailed information on how to use the DDR LPSDRAM device, refer to the
M65KG256AB datasheet which is available from your local STMicroelectronics distributor.
Figure 1.
Logic Diagram: NAND Flash & 1 x SDR LPSDRAM
Ai11024b
13
A0-A12
DQ0-DQ15
16
K
KE
WD
VDDQD
ED
CAS
DQM0
DQM1
VDDF
WF
VDDD
NAND256-M
NAND512-M
NAND01G-M
EF
VSSD
WP
AL
CL
RB
R
RAS
2
BA0-BA1
8/16
I/O8-I/O15, x16
I/O0-I/O7, x8/x16
VSSQD
VSSF
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相关代理商/技术参数 |
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| NAND512R4A2CWFD | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512R4A2CZA6 | 制造商:Micron Technology Inc 功能描述:512MB. 3V X8 NO OPTION TSOP48TSOP-1 48 12X20 AL 42 - Trays |
| NAND512R4A2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512W3A0AN6 | 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| NAND512W3A0AN6E | 功能描述:闪存 2.7-3.6V 512M(64Mx8) RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
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