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参数资料
| 型号： | NCN6001DTBEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 30/36页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR NCN6001DTB |
| 设计资源： | NCN6001DTBEVB Gerber Files NCN6001 Demo Brd Schematic NCN6001DBEVB BOM |
| 标准包装： | 1 |
| 主要目的： | 接口，智能卡 |
| 嵌入式： | 是，MCU，8 位 |
| 已用 IC / 零件： | NCN6001 |
| 主要属性： | 与 ISO 7816-3，EMV，GIE-CB 兼容 |
| 次要属性： | 符合 GSM 规定 |
| 已供物品： | 板 |
| 其它名称： | NCN6001DTBEVBOS |
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NCN6001
http://onsemi.com
36
PACKAGE DIMENSIONS
20 PIN LLGA, 6x5, 0.8P
CASE 513AC01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C
0.15
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
E4
D2
E2
C
C
0.15
C
0.10
C
0.08
20X
A1
SEATING
PLANE
e
NOTE 3
b
19X
0.10
C
0.05
C
A B
B
DIM
MIN
MAX
MILLIMETERS
A
0.50
0.60
A1
0.00
0.05
b
0.25
0.35
D3
4.60 BSC
D2
2.90
3.10
E
5.00 BSC
E2
1.90
2.10
e
0.80 BSC
G
1.05
1.25
L
0.25
0.35
15
11
J
0.15
0.25
20
16
b2
16X
b2
0.35
0.45
D
6.00 BSC
E3
3.70 BSC
D3
E3
6
10
e
L
20X
J
4.05
2.10
0.80
19X
0.35
1.95
4.60
DIMENSIONS: MILLIMETERS
1
3.70
3.10
20X
0.35
PITCH
1.20
0.45
0.80
PITCH
0.35
0.25
2.63
K
0.10 MIN
G2
1.95 BSC
G
2.55
2.75
E4
3.90
4.10
K
G
G3
G2
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
NCN6001/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
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