参数资料
型号: NCN6001DTBEVB
厂商: ON Semiconductor
文件页数: 34/36页
文件大小: 0K
描述: EVAL BOARD FOR NCN6001DTB
设计资源: NCN6001DTBEVB Gerber Files
NCN6001 Demo Brd Schematic
NCN6001DBEVB BOM
标准包装: 1
主要目的: 接口,智能卡
嵌入式: 是,MCU,8 位
已用 IC / 零件: NCN6001
主要属性: 与 ISO 7816-3,EMV,GIE-CB 兼容
次要属性: 符合 GSM 规定
已供物品:
其它名称: NCN6001DTBEVBOS
NCN6001
http://onsemi.com
7
MAXIMUM RATINGS (TA = +25C unless otherwise noted)
Rating
Symbol
Value
Unit
Power Supply Voltage
VCC
6.0
V
Power Supply Current
Note: This current represents the maximum peak current the
pin can sustain, not the NCN6001 average consumption.
Ibat
500
mA
Power Supply Current
ICC
150 (Internally Limited)
mA
Digital Input Pins
Vin
0.5 V < Vin < VCC +0.5 V, but < 6.0 V
V
Digital Input Pins
Iin
5.0
mA
Digital Output Pins
Vout
0.5 V < Vin < VCC +0.5 V, but < 6.0 V
V
Digital Output Pins
Iout
10
mA
Card Interface Pins
Vcard
0.5 V < Vcard < CRD_VCC +0.5 V
V
Card Interface Pins, excepted CRD_CLK
Icard
15 (Internally Limited)
mA
Inductor Current
ILout
500 (Internally Limited)
mA
ESD Capability (Note 1)
Standard Pins
Card Interface Pins
CRD_DET
VESD
2.0
8.0
4.0
kV
Power Dissipation @ Tamb = +85C
Thermal Resistance, JunctiontoAir (RqJA)
PDS
RqJA
320
125
mW
C/W
Operating Ambient Temperature Range
TA
25 to +85
C
Operating Junction Temperature Range
TJ
25 to +125
C
Maximum Junction Temperature (Note 2)
TJmax
+150
C
Storage Temperature Range
Tstg
65 to +150
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Human Body Model, R = 1500 W, C = 100 pF.
2. Absolute Maximum Rating beyond which damage to the device may occur.
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