- 您现在的位置：买卖IC网 > PDF目录299576 > OR3T55-4BA256 FPGA, 324 CLBS, 40000 GATES, 80 MHz, PBGA256 PDF资料下载
参数资料
| 型号： | OR3T55-4BA256 |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 324 CLBS, 40000 GATES, 80 MHz, PBGA256 |
| 封装： | PLASTIC, BGA-256 |
| 文件页数： | 106/210页 |
| 文件大小： | 2138K |
| 代理商： | OR3T55-4BA256 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页当前第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页第188页第189页第190页第191页第192页第193页第194页第195页第196页第197页第198页第199页第200页第201页第202页第203页第204页第205页第206页第207页第208页第209页第210页
194
Lucent Technologies Inc.
Preliminary Data Sheet, Rev. 1 , Rev. 1
September 1998
ORCA Series 3 FPGAs
Package Thermal Characteristics
There are three thermal parameters that are in com-
mon use:
ΘJA, ψJC, and ΘJC. It should be noted that all
the parameters are affected, to varying degrees, by
package design (including paddle size) and choice of
materials, the amount of copper in the test board or
system board, and system airflow.
The data base containing the thermal values for all of
Lucent Technologies’ IC packages is currently being
updated to conform to modern JEDEC standards.
Thus, Table 74 contains the currently available thermal
specifications for Lucent Technologies’ FPGA pack-
ages mounted on both JEDEC and non-JEDEC test
boards. The thermal values for the newer package
types correspond to those packages mounted on a
JEDEC four-layer board (indicated as Note 5 under the
table). The values for the older packages, however, cor-
respond to those packages mounted on a non-JEDEC,
single-layer, sparse copper board (see Note 2). It
should also be noted that the values for the older pack-
ages are considered conservative.
ΘJA
This is the thermal resistance from junction to ambient
(a.k.a. theta-JA, R-theta, etc.).
where TJ is the junction temperature, TA is the ambient
air temperature, and Q is the chip power.
Experimentally,
ΘJA is determined when a special ther-
mal test die is assembled into the package of interest,
and the part is mounted on the thermal test board. The
diodes on the test chip are separately calibrated in an
oven. The package/board is placed either in a JEDEC
natural convection box or in the wind tunnel, the latter
for forced convection measurements. A controlled
amount of power (Q) is dissipated in the test chip’s
heater resistor, the chip’s temperature (TJ) is deter-
mined by the forward drop on the diodes, and the ambi-
ent temperature (TA) is noted. Note that
ΘJA is
expressed in units of °C/watt.
ψJC
This JEDEC designated parameter correlates the junc-
tion temperature to the case temperature. It is generally
used to infer the junction temperature while the device
is operating in the system. It is not considered a true
thermal resistance, and it is defined by:
where TC is the case temperature at top dead center,
TJ is the junction temperature, and Q is the chip power.
During the
ΘJA measurements described above,
besides the other parameters measured, an additional
temperature reading, TC, is made with a thermocouple
attached at top-dead-center of the case.
ψJC is also
expressed in units of °C/watt.
ΘJC
This is the thermal resistance from junction to case. It
is most often used when attaching a heat sink to the
top of the package. It is defined by:
The parameters in this equation have been defined
above. However, the measurements are performed with
the case of the part pressed against a water-cooled
heat sink so as to draw most of the heat generated by
the chip out the top of the package. It is this difference
in the measurement process that differentiates
ΘJC
from ψJC.
ΘJC is a true thermal resistance and is
expressed in units of °C/watt.
ΘJB
This is the thermal resistance from junction to board
(a.k.a.
ΘJL). It is defined by:
where TB is the temperature of the board adjacent to a
lead measured with a thermocouple. The other param-
eters on the right-hand side have been defined above.
This is considered a true thermal resistance, and the
measurement is made with a water-cooled heat sink
pressed against the board so as to draw most of the
heat out of the leads. Note that
ΘJB is expressed in
units of °C/watt, and that this parameter and the way it
is measured is still in JEDEC committee.
ΘJA
TJ
TA
–
Q
--------------------
=
ψJC
TJ
TC
–
Q
--------------------
=
ΘJC
TJ
TC
–
Q
--------------------
=
ΘJB
TJ
TB
–
Q
--------------------
=
相关PDF资料 |
PDF描述 |
|---|---|
| OR3T55-4BA352I | FPGA, 324 CLBS, 40000 GATES, 80 MHz, PBGA352 |
| OR3T55-4BA352 | FPGA, 324 CLBS, 40000 GATES, 80 MHz, PBGA352 |
| OR3T80-4BA352I | FPGA, 484 CLBS, 58000 GATES, 80 MHz, PBGA352 |
| OR3T80-4BA352 | FPGA, 484 CLBS, 58000 GATES, 80 MHz, PBGA352 |
| OR3T125-4BC432I | FPGA, 784 CLBS, 92000 GATES, 80 MHz, PBGA432 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| OR3T55-4BA256I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA) |
| OR3T55-4PS208I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA) |
| OR3T55-4PS240I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA) |
| OR3T55-5BA256 | 制造商:AGERE 制造商全称:AGERE 功能描述:3C and 3T Field-Programmable Gate Arrays |
| OR3T55-5BA256I | 制造商:AGERE 制造商全称:AGERE 功能描述:3C and 3T Field-Programmable Gate Arrays |
发布紧急采购，3分钟左右您将得到回复。