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| 型号： | PF48F4400P0VBQ0 |
| 厂商： | INTEL CORP |
| 元件分类： | PROM |
| 英文描述： | Intel StrataFlash Embedded Memory |
| 中文描述： | 32M X 16 FLASH 1.8V PROM, 88 ns, PBGA88 |
| 封装： | 8 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-88 |
| 文件页数： | 65/102页 |
| 文件大小： | 1609K |
| 代理商： | PF48F4400P0VBQ0 |
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1-Gbit P30 Family
Datasheet
Intel StrataFlash
Embedded Memory (P30)
Order Number: 306666, Revision: 001
April 2005
65
Two basic sequences repeat in this phase: loading of the write buffer, followed by buffer data
programming to the array. For BEFP, the count value for buffer loading is always the maximum
buffer size of 32 words. During the buffer-loading sequence, data is stored to sequential buffer
locations starting at address 0x00. Programming of the buffer contents to the flash memory array
starts as soon as the buffer is full. If the number of words is less than 32, the remaining buffer
locations must be filled with 0xFFFF.
Caution:
The buffer must be completely filled for programming to occur. Supplying an address outside of the
current block's range during a buffer-fill sequence causes the algorithm to exit immediately. Any
data previously loaded into the buffer during the fill cycle is not programmed into the array.
The starting address for data entry must be buffer size aligned, if not the BEFP algorithm will be
aborted and the program fails and (SR[4]) flag will be set.
Data words from the write buffer are directed to sequential memory locations in the flash memory
array; programming continues from where the previous buffer sequence ended. The host
programming system must poll SR[0] to determine when the buffer program sequence completes.
SR[0] cleared indicates that all buffer data has been transferred to the flash array; SR[0] set
indicates that the buffer is not available yet for the next fill cycle. The host system may check full
status for errors at any time, but it is only necessary on a block basis after BEFP exit. After the
buffer fill cycle, no write cycles should be issued to the device until SR[0] = 0 and the device is
ready for the next buffer fill.
Note:
Any spurious writes are ignored after a buffer fill operation and when internal program is
proceeding.
The host programming system continues the BEFP algorithm by providing the next group of data
words to be written to the buffer. Alternatively, it can terminate this phase by changing the block
address to one outside of the current block’s range.
The Program/Verify phase concludes when the programmer writes to a different block address;
data supplied must be 0xFFFF. Upon Program/Verify phase completion, the device enters the
BEFP Exit phase.
11.3.4
BEFP Exit Phase
When SR[7] is set, the device has returned to normal operating conditions. A full status check
should be performed at this time to ensure the entire block programmed successfully. When exiting
the BEFP algorithm with a block address change, the read mode will not change. After BEFP exit,
any valid command can be issued to the device.
11.4
Program Suspend
Issuing the Program Suspend command while programming suspends the programming operation.
This allows data to be accessed from the device other than the one being programmed. The
Program Suspend command can be issued to any device address. A program operation can be
suspended to perform reads only. Additionally, a program operation that is running during an erase
suspend can be suspended to perform a read operation (see
Figure 41, “Program Suspend/Resume
Flowchart” on page 86
).
相关PDF资料 |
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| PF48F2000P0ZTQ0 | Intel StrataFlash Embedded Memory |
| PF48F3000P0ZTQ0 | Circular Connector; Body Material:Aluminum; Series:PT00; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Pin; Insert Arrangement:10-6 |
| PF48F4000P0ZTQ0 | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle |
| PF48F0P0ZTQ0 | Circular Connector; Body Material:Aluminum; Series:PT00; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Socket; Insert Arrangement:10-98 |
| PF48F2P0ZTQ0 | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; No. of Contacts:10; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle |
相关代理商/技术参数 |
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| PF48F4400P0VBQ0A | 功能描述:IC FLASH 512MBIT 85NS 88TPBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:StrataFlash™ 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步，DDR II 存储容量:18M（1M x 18） 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA（13x15） 包装:托盘 其它名称:71P71804S200BQ |
| PF48F4400P0VBQ2E | 制造商:Micron Technology Inc 功能描述:32MX16 NOR FLASH PLASTIC PBF TFBGA 1.8V - Trays 制造商:Micron Technology Inc 功能描述:IC FLASH 512MBIT 85NS TFBGA |
| PF48F4400P0VBQ2F | 制造商:Micron Technology Inc 功能描述:32MX16 NOR FLASH PLASTIC PBF TFBGA 1.8V - Tape and Reel |
| PF48F4400P0VBQE0 | 功能描述:IC FLASH 512MBIT 100NS 88SCSP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:Axcell™ 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M（64M x 8） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040 |
| PF48F4400P0VBQE3 | 功能描述:IC FLASH 512MBIT 100NS 88SCSP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:Axcell™ 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M（64M x 8） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040 |
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