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型号： PF48F4400P0VBQ0
厂商： INTEL CORP
元件分类： PROM
英文描述： Intel StrataFlash Embedded Memory
中文描述： 32M X 16 FLASH 1.8V PROM, 88 ns, PBGA88
封装： 8 X 11 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-88
文件页数： 78/102页
文件大小： 1609K
代理商： PF48F4400P0VBQ0
1-Gbit P30 Family
April 2005
78
Intel StrataFlash
Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
Appendix A Write State Machine
Figure 34
through
Figure 39
show the command state transitions (Next State Table) based on
incoming commands. Only one partition can be actively programming or erasing at a time. Each
partition stays in its last read state (Read Array, Read Device ID, CFI Query or Read Status Register)
until a new command changes it. The next WSM state does not depend on the partition’s output state.
Figure 34.
Write State Machine—Next State Table (Sheet 1 of 6)
Read
Array
(2)
Word
Program
(3,4)
Buffered
Program
(BP)
Erase
Setup
(3,4)
Buffered
Enhanced
Factory Pgm
Setup
(3, 4)
BE Confirm,
P/E
Resume,
ULB,
Confirm
(8)
BP / Prg /
Erase
Suspend
Read
Status
Clear
Status
Register
(5)
Read
ID/Query
Lock, Unlock,
Lock-down,
CR setup
(4)
(FFH)
(10H/40H)
(E8H)
(20H)
(80H)
(D0H)
(B0H)
(70H)
(50H)
(90H, 98H)
(60H)
Ready
Program
Setup
BP Setup
Erase
Setup
BEFP Setup
Lock/CR
Setup
Ready
(Unlock
Block)
Setup
Busy
Setup
Busy
Word
Program
Suspend
Suspend
Word
Program
Busy
Setup
BP Load 1
BP Load 2
BP
Confirm
BP Busy
BP Busy
BP Suspend
BP
Suspend
BP Busy
Setup
Erase Busy
Busy
Erase
Suspend
Suspend
Erase
Suspend
Word
Program
Setup in
Erase
Suspend
BP Setup in
Erase
Suspend
Erase Busy
Lock/CR
Setup in
Erase
Suspend
BP Suspend
Erase
BP Busy
Erase Busy
Erase Suspend
Erase Suspend
Ready (Error)
Erase Busy
BP Suspend
Ready (Error)
Word
Program
Program Busy
Word Program Suspend
Word Program Busy
OTP
Ready (Lock Error)
Ready
Ready
Ready (Lock Error)
OTP Busy
Current Chip
State
(7)
Command Input to Chip and resulting
Chip
Next State
BP
BP Busy
Lock/CR Setup
BP Load 2
Ready (Error)
Ready (Error)
Word Program Busy
BP Confirm if Data load into Program Buffer is complete; Else BP Load 2
Word Program Suspend
BP Load 1
相关PDF资料
PDF描述
PF48F2000P0ZTQ0 Intel StrataFlash Embedded Memory
PF48F3000P0ZTQ0 Circular Connector; Body Material:Aluminum; Series:PT00; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Pin; Insert Arrangement:10-6
PF48F4000P0ZTQ0 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle
PF48F0P0ZTQ0 Circular Connector; Body Material:Aluminum; Series:PT00; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Socket; Insert Arrangement:10-98
PF48F2P0ZTQ0 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; No. of Contacts:10; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle
相关代理商/技术参数
参数描述
PF48F4400P0VBQ0A 功能描述:IC FLASH 512MBIT 85NS 88TPBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:StrataFlash™ 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步，DDR II 存储容量:18M（1M x 18） 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA（13x15） 包装:托盘 其它名称:71P71804S200BQ
PF48F4400P0VBQ2E 制造商:Micron Technology Inc 功能描述:32MX16 NOR FLASH PLASTIC PBF TFBGA 1.8V - Trays 制造商:Micron Technology Inc 功能描述:IC FLASH 512MBIT 85NS TFBGA
PF48F4400P0VBQ2F 制造商:Micron Technology Inc 功能描述:32MX16 NOR FLASH PLASTIC PBF TFBGA 1.8V - Tape and Reel
PF48F4400P0VBQE0 功能描述:IC FLASH 512MBIT 100NS 88SCSP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:Axcell™ 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M（64M x 8） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
PF48F4400P0VBQE3 功能描述:IC FLASH 512MBIT 100NS 88SCSP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:Axcell™ 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M（64M x 8） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040
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