参数资料
型号: PIC12F1840T-I/MF
厂商: Microchip Technology
文件页数: 70/122页
文件大小: 0K
描述: MCU 7KB FLASH 256B RAM XLP 8DFN
标准包装: 3,300
系列: PIC® XLP™ 12F
核心处理器: PIC
芯体尺寸: 8-位
速度: 32MHz
连通性: I²C,LIN,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 5
程序存储器容量: 7KB(4K x 14)
程序存储器类型: 闪存
EEPROM 大小: 256 x 8
RAM 容量: 256 x 8
电压 - 电源 (Vcc/Vdd): 2.3 V ~ 5.5 V
数据转换器: A/D 4x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 8-VDFN 裸露焊盘
包装: 带卷 (TR)
2011 Microchip Technology Inc.
Preliminary
DS41441B-page 51
PIC12(L)F1840
5.2.1.5
TIMER1 Oscillator
The Timer1 Oscillator is a separate crystal oscillator
that is associated with the Timer1 peripheral. It is opti-
mized for timekeeping operations with a 32.768 kHz
crystal connected between the T1OSO and T1OSI
device pins.
The Timer1 Oscillator can be used as an alternate sys-
tem clock source and can be selected during run-time
using clock switching. Refer to Section 5.3 “Clock
for more information.
FIGURE 5-5:
QUARTZ CRYSTAL
OPERATION (TIMER1
OSCILLATOR)
5.2.1.6
External RC Mode
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required.
The RC circuit connects to OSC1. OSC2/CLKOUT is
available for general purpose I/O or CLKOUT. The
function of the OSC2/CLKOUT pin is determined by the
state of the CLKOUTEN bit in Configuration Word 1.
Figure 5-6 shows the external RC mode connections.
FIGURE 5-6:
EXTERNAL RC MODES
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
threshold voltage variation
component tolerances
packaging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
Note 1:
Quartz
crystal
characteristics
vary
according
to
type,
package
and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2:
Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3:
For oscillator design assistance, reference
the following Microchip Applications Notes:
AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC and PIC
Devices
” (DS00826)
AN849, “Basic PIC Oscillator Design”
(DS00849)
AN943, “Practical PIC Oscillator
Analysis and Design
” (DS00943)
AN949, “Making Your Oscillator Work”
(DS00949)
TB097, “Interfacing a Micro Crystal
MS1V-T1K 32.768 kHz Tuning Fork
Crystal to a PIC16F690/SS
” (DS91097)
AN1288, “Design Practices for
Low-Power External Oscillators
(DS01288)
C1
C2
32.768 kHz
T1OSI
To Internal
Logic
PIC MCU
Crystal
T1OSO
Quartz
OSC2/CLKOUT
CEXT
REXT
PIC MCU
OSC1/CLKIN
FOSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 k
REXT 100 k, <3V
3 k
REXT 100 k, 3-5V
CEXT > 20 pF, 2-5V
Note
1:
Output depends upon CLKOUTEN bit of the
Configuration Word 1.
I/O(1)
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