参数资料
型号: RK80546KG0882MM
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, 3200 MHz, MICROPROCESSOR, CPGA604
封装: FLIP CHIP, MICRO PGA-604
文件页数: 100/106页
文件大小: 4724K
代理商: RK80546KG0882MM
Datasheet
93
Boxed Processor Specifications
NOTE:
1. The heatsink in this image is for reference only, and may not represent any of the actual boxed processor
heatsinks.
2. The screws, springs, and standoffs will be captive to the heatsink. This image shows all of the components in
an exploded view.
3. It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping.
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
8.2.1
Boxed Processor Heatsink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is required
around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space
requirements and dimensions for the boxed processor and assembled heatsink are shown in
Figure 8-5 through Figure 8-9. Figure 8-10 through Figure 8-11 are the mechanical drawings for
the 4-pin server board fan header and 4-pin connector used for the active CEK fan heatsink
solution.
Figure 8-4. Passive 64-bit Intel Xeon Processor with 2 MB L2 Cache Thermal
Solution (2U and Larger)
Heat sink
Heat sink standoffs
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring
Heat sink
Heat sink standoffs
Heat sink screw
springs
Thermal Interface
Material
Heat sink
screws
Motherboard
and
processor
Chassis pan
Protective Tape
CEK spring
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