参数资料
型号: RK80546KG0882MM
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, 3200 MHz, MICROPROCESSOR, CPGA604
封装: FLIP CHIP, MICRO PGA-604
文件页数: 36/106页
文件大小: 4724K
代理商: RK80546KG0882MM
Datasheet
35
3
Mechanical Specifications
The 64-bit Intel Xeon processor with 2 MB L2 cache is packaged in Flip Chip Micro Pin Grid
Array (FC-mPGA4) package that interfaces to the baseboard via an mPGA604 socket. The
package consists of a processor core mounted on a substrate pin-carrier. An integrated heat
spreader (IHS) is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the
processor package components and how they are assembled together. Refer to the mPGA604
Socket Design Guidelines for complete details on the mPGA604 socket.
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Processor die
3. Substrate
4. Pin side capacitors
5. Package pin
6. Die Side Capacitors
Note:
This drawing is not to scale and is for reference only. The mPGA604 socket is not shown.
Figure 3-1. Processor Package Assembly Sketch
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3
5
4
6
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3
5
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