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参数资料
| 型号： | RK80546KG0882MM |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 3200 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 4/106页 |
| 文件大小： | 4724K |
| 代理商： | RK80546KG0882MM |
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Datasheet
101
Boxed Processor Specifications
8.2.2
Boxed Processor Heatsink Weight
8.2.2.1
Thermal Solution Weight
The 2U passive and 2U+ active heatsink solutions will not exceed a mass of 1050 grams. Note that
this is per processor, so a dual processor system will have up to 2100 grams total mass in the
heatsinks. The 1U CEK heatsink will not exceed a mass of 700 grams, for a total of 1400 grams in
a dual processor system. This large mass will require a minimum chassis stiffness to be met in
order to withstand force during shock and vibration.
See Section 3 for details on the processor weight.
8.2.3
Boxed Processor Retention Mechanism and Heatsink
Support (CEK)
Baseboards and chassis designed for use by a system integrator should include holes that are in
proper alignment with each other to support the boxed processor. Refer to the Server System
Infrastructure Specification (SSI-EEB 3.51) or see http://www.ssiforum.org for details on the hole
locations.
Figure 8-4 illustrates the new Common Enabling Kit (CEK) retention solution. The CEK is
designed to extend air-cooling capability through the use of larger heatsinks with minimal airflow
blockage and bypass. CEK retention mechanisms can allow the use of much heavier heatsink
masses compared to legacy limits by using a load path directly attached to the chassis pan. The
CEK spring on the secondary side of the baseboard provides the necessary compressive load for
the thermal interface material. The baseboard is intended to be isolated such that the dynamic loads
from the heatsink are transferred to the chassis pan via the stiff screws and standoffs. The retention
scheme reduces the risk of package pullout and solder joint failures.
The baseboard mounting holes for the CEK solution are the same location as the legacy server
processor hole locations, as specified by the SSI EEB 3.5. However, the CEK assembly requires
larger diameter holes to compensate for the CEK spring embosses. The holes now need to be 10.2
mm [0.402 in.] in diameter.
All components of the CEK heatsink solution will be captive to the heatsink and will only require a
Phillips screwdriver to attach to the chassis pan. When installing the CEK, the CEK screws should
be tightened until they will no longer turn easily. This should represent approximately 8 inch-
pounds of torque. Avoid applying more than 10 inch-pounds of torque; otherwise, damage may
occur to retention mechanism components.
For further details on the CEK thermal solution, refer to the 64-bit Intel Xeon Processor with 2
MB L2 Cache Thermal/Mechanical Design Guidelines (see Section 1.2).
8.3
Electrical Requirements
8.3.1
Fan Power Supply (Active CEK)
The 4-pin PWM/T-diode-controlled active thermal solution is being offered to help provide better
control over pedestal chassis acoustics. This is achieved though more accurate measurement of
processor die temperature through the processor’s temperature diode (T-diode). Fan RPM is
modulated through the use of an ASIC located on the baseboard, that sends out a PWM control
signal to the 4th pin of the connector labeled as Control. This thermal solution requires a constant
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