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参数资料
| 型号： | RK80546KG0882MM |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 3200 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 98/106页 |
| 文件大小： | 4724K |
| 代理商： | RK80546KG0882MM |
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Datasheet
91
8
Boxed Processor Specifications
8.1
Introduction
Intel boxed processors are intended for system integrators who build systems from components
available through distribution channels. The 64-bit Intel Xeon processor with 2 MB L2 cache and
64-bit Intel Xeon LV 3 GHz processor will be offered as Intel boxed processors.
Intel will offer boxed 64-bit Intel Xeon processors with 2 MB L2 cache and 64-bit Intel Xeon LV
3 GHz processors in three product configurations available for each processor frequency: 1U
passive, 2U passive and 2U+ active. Although the active thermal solution mechanically fits into a
2U keepout, additional design considerations may need to be addressed to provide sufficient
airflow to the fan inlet.
The active thermal solution is primarily designed to be used in a pedestal chassis where sufficient
air inlet space is present and side directional airflow is not an issue. The 1U and 2U passive thermal
solutions require the use of chassis ducting and are targeted for use in rack mount servers. The
retention solution used for these products is called the Common Enabling Kit, or CEK. The CEK
base is compatible with all three thermal solutions.
The active heatsink solution for the boxed 64-bit Intel Xeon processor with 2 MB L2 cache will be
a 4-pin pulse width modulated (PWM) T-diode controlled solution. Use of a 4-pin PWM T-diode
controlled active thermal solution helps customers meet acoustic targets in pedestal platforms
through the platform’s ability to directly control the active thermal solution. It may be necessary to
modify existing baseboard designs with 4-pin CPU fan headers and other required circuitry for
PWM operation. If a 4-pin PWM T-diode controlled active thermal solution is connected to an
older 3-pin CPU fan header, the thermal solution will revert back to a thermistor controlled mode.
Please see the Section 8.3, “Electrical Requirements” on page 8-101 for more details.
Figure 8-1 through Figure 8-3 are representations of the three heatsink solutions that will be
offered as part of a boxed processor. Figure 8-4 shows an exploded view of the boxed processor
thermal solution and the other CEK retention components.
Figure 8-1. 1U Passive CEK Heatsink
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80546KG0882MMS L7ZE | 制造商:Intel 功能描述:XEON 3.2,2M,800MHZ,FC-MPGA4 - Trays |
| RK80546KG1041M | 制造商:Rochester Electronics LLC 功能描述:XEON 3.6GHZ,1M,800MHZ,FC MPGA4 - Bulk |
| RK80546KG1041M S L7PH | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU XEON 90NM 3.6GHZ 604PIN PGA - Trays |
| RK80546KG1122MM | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Intel 功能描述: |
| RK80546KG1122MMS | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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