- 您现在的位置：买卖IC网 > PDF目录69322 > RK80546KG0882MM (INTEL CORP) 64-BIT, 3200 MHz, MICROPROCESSOR, CPGA604 PDF资料下载
参数资料
| 型号： | RK80546KG0882MM |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 3200 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 7/106页 |
| 文件大小： | 4724K |
| 代理商： | RK80546KG0882MM |
第1页第2页第3页第4页第5页第6页当前第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页
104
Datasheet
Boxed Processor Specifications
Thermal Profile A should be used to help determine the thermal performance of the platform.
Once again it is recommended that the ambient air temperature outside of the chassis be kept at or
below 35
° C. The air passing directly over the processor thermal solution should not be preheated
by other system components. Meeting the processor’s temperature specification is the
responsibility of the system integrator.
8.4
Boxed Processor Contents
A direct chassis attach method must be used to avoid problems related to shock and vibration, due
to the weight of the thermal solution required to cool the processor. The board must not bend
beyond specification in order to avoid damage. The boxed processor contains the components
necessary to solve both issues. The boxed processor will include the following items:
64-bit Intel Xeon processor with 2 MB L2 cache or 64-bit Intel Xeon LV 3 GHz processor
Unattached (Active or Passive) Thermal Solution
Four screws, four springs, and four heatsink standoffs (all captive to the heatsink)
Thermal Interface Material (pre-applied on heatsink)
Installation Manual
Intel Inside Logo
The other items listed in Figure 8-4 that are required to compete this solution will be shipped with
either the chassis or boards. They are as follows:
CEK Spring (supplied by baseboard vendors)
Heatsink Standoffs (supplied by chassis vendors)
相关PDF资料 |
PDF描述 |
|---|---|
| RK80546KG1042MM | 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604 |
| RK80546KG0802MM | 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604 |
| RK80546PG0801M | 32-BIT, 3000 MHz, MICROPROCESSOR, CPGA478 |
| RK80546PE0721M | 32-BIT, 2800 MHz, MICROPROCESSOR, CPGA478 |
| RL5C478A | PCI BUS CONTROLLER, PQFP256 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80546KG0882MMS L7ZE | 制造商:Intel 功能描述:XEON 3.2,2M,800MHZ,FC-MPGA4 - Trays |
| RK80546KG1041M | 制造商:Rochester Electronics LLC 功能描述:XEON 3.6GHZ,1M,800MHZ,FC MPGA4 - Bulk |
| RK80546KG1041M S L7PH | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU XEON 90NM 3.6GHZ 604PIN PGA - Trays |
| RK80546KG1122MM | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Intel 功能描述: |
| RK80546KG1122MMS | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
发布紧急采购，3分钟左右您将得到回复。