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参数资料
型号： RK80546KG1042MM
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604
封装： FLIP CHIP, MICRO PGA-604
文件页数： 30/106页
文件大小： 4724K
代理商： RK80546KG1042MM
Datasheet
3
Contents
1
Introduction....................................................................................................................... 11
1.1
Terminology......................................................................................................... 12
1.2
References .......................................................................................................... 14
1.3
State of Data ....................................................................................................... 15
2
Electrical Specifications................................................................................................... 17
2.1
Power and Ground Pins ...................................................................................... 17
2.2
Decoupling Guidelines ........................................................................................ 17
2.2.1
VCC Decoupling ..................................................................................... 17
2.2.2
VTT Decoupling...................................................................................... 17
2.2.3
Front Side Bus AGTL+ Decoupling ........................................................ 18
2.3
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking................................ 18
2.3.1
Front Side Bus Frequency Select Signals (BSEL[1:0]) .......................... 18
2.3.2
Phase Lock Loop (PLL) and Filter .......................................................... 19
2.4
Voltage Identification (VID).................................................................................. 20
2.5
Reserved Or Unused Pins................................................................................... 22
2.6
Front Side Bus Signal Groups............................................................................. 22
2.7
GTL+ Asynchronous and AGTL+ Asynchronous Signals ................................... 24
2.8
Test Access Port (TAP) Connection.................................................................... 24
2.9
Mixing Processors ............................................................................................... 25
2.10
Absolute Maximum and Minimum Ratings .......................................................... 25
2.11
Processor DC Specifications............................................................................... 26
2.11.1 Flexible Motherboard Guidelines (FMB)................................................. 26
2.11.2 VCC Overshoot Specification ................................................................. 31
2.11.3 Die Voltage Validation ............................................................................ 32
3
Mechanical Specifications ................................................................................................ 35
3.1
Package Mechanical Drawings ........................................................................... 36
3.2
Processor Component Keepout Zones ............................................................... 39
3.3
Package Loading Specifications ......................................................................... 39
3.4
Package Handling Guidelines ............................................................................. 40
3.5
Package Insertion Specifications ........................................................................ 40
3.6
Processor Mass Specifications ........................................................................... 40
3.7
Processor Materials............................................................................................. 40
3.8
Processor Markings............................................................................................. 41
3.9
Processor Pin-Out Coordinates........................................................................... 42
4
Signal Definitions.............................................................................................................. 45
4.1
Signal Definitions................................................................................................. 45
5
Pin Listing......................................................................................................................... 55
5.1
64-bit Intel Xeon Processor with 2 MB L2 Cache Pin Assignments .............. 55
5.1.1
Pin Listing by Pin Name ......................................................................... 55
5.1.2
Pin Listing by Pin Number ...................................................................... 63
6
Thermal Specifications .................................................................................................... 71
6.1
Package Thermal Specifications ......................................................................... 71
6.1.1
Thermal Specifications ........................................................................... 71
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