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参数资料
| 型号： | RK80546KG1042MM |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 84/106页 |
| 文件大小： | 4724K |
| 代理商： | RK80546KG1042MM |
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Datasheet
79
Thermal Specifications
6.2
Processor Thermal Features
6.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the Thermal
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption as needed by modulating (starting and stopping) the
internal processor core clocks. The Thermal Monitor (or Thermal Monitor 2) feature must be
enabled for the processor to be operating within specifications. The temperature at which Thermal
Monitor activates the thermal control circuit is not user configurable and is not software visible.
Bus traffic is snooped in the normal manner, and interrupt requests are latched (and serviced during
the time that the clocks are on) while the TCC is active.
When the Thermal Monitor is enabled, and a high temperature situation exists (i.e. TCC is active),
the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to
the processor (typically 30 -50%). Clocks will not be off for more than 3 microseconds when the
TCC is active. Cycle times are processor speed dependent and will decrease as processor core
frequencies increase. A small amount of hysteresis has been included to prevent rapid active/
inactive transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating temperature, and
the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.
With a thermal solution designed to meet Thermal Profile A, it is anticipated that the TCC would
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
expected to be so minor that it would be immeasurable. A thermal solution that is designed to
Thermal Profile B may cause a noticeable performance loss due to increased TCC activation.
Thermal Solutions that exceed Thermal Profile B will exceed the maximum temperature
specification and affect the long-term reliability of the processor. In addition, a thermal solution
that is significantly under designed may not be capable of cooling the processor even when the
TCC is active continuously. Refer to the appropriate thermal/mechanical design guide for
information on designing a thermal solution.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and
cannot be modified. The Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines.
6.2.2
Thermal Monitor 2
The 64-bit Intel Xeon processor with 2 MB L2 cache also supports an additional power reduction
capability known as Thermal Monitor 2. This mechanism provides an efficient means for limiting
the processor temperature by reducing the power consumption within the processor. The Thermal
Monitor (or Thermal Monitor 2) feature must be enabled for the processor to be operating within
specifications.
Note: Not all Intel Xeon processors may be capable of supporting Thermal Monitor 2. Details on
which processor frequencies support Thermal Monitor 2 are provided in the 64-bit Intel Xeon
Processor with 800 MHz System Bus (1 MB and 2 MB L2 Cache Versions) Specification Update.
When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the Thermal
Control Circuit (TCC) will be activated. The TCC causes the processor to adjust its operating
frequency (via the bus multiplier) and input voltage (via the VID signals). This combination of
reduced frequency and VID results in a reduction to the processor power consumption.
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