参数资料
型号: RK80546KG1042MM
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, 3600 MHz, MICROPROCESSOR, CPGA604
封装: FLIP CHIP, MICRO PGA-604
文件页数: 83/106页
文件大小: 4724K
代理商: RK80546KG1042MM
78
Datasheet
Thermal Specifications
6.1.2
Thermal Metrology
The maximum case temperatures (TCASE) are specified in Table 6-2, Table 6-3, Table 6-5,
Table 6-6, and Table 6-8 measured at the geometric top center of the processor integrated heat
spreader (IHS). Figure 6-4 illustrates the location where TCASE temperature measurements should
be made. For detailed guidelines on temperature measurement methodology, refer to the
appropriate thermal/mechanical design guide.
Note:
Figure is not to scale and is for reference only.
Table 6-8. 64-bit Intel Xeon LV 3 GHz Processor Thermal Profile (PRB = 0)
Po w e r [W ]
T CASE_MAX [d e g C ]
P o w e r [W ]
T CASE_MAX [d eg C ]
05 5
3 0
7 2
2
56
32
73
4
57
34
74
6
58
36
75
8
59
38
76
10
61
40
77
12
62
42
79
14
63
44
80
16
64
46
81
18
65
48
82
20
66
50
83
22
67
52
84
24
68
54
85
26
70
55
86
28
71
Figure 6-4. Case Temperature (TCASE) Measurement Location
21.25 mm
[0.837 in.
21.25 mm
[0.837 in.
Measure from Edge of Processor
Measure T
CASE at
this point.
42.5 mm FC-mPGA4 Package
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