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| 型号： | S29GL032M10BAIR42 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 33uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 3528-21; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 3.5mm x 2.8mm x 1.9mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 2,000; Features: Low Temperature |
| 中文描述： | 2M X 16 FLASH 3V PROM, 100 ns, PBGA48 |
| 封装： | 8 X 9 MM, FBGA-48 |
| 文件页数： | 17/116页 |
| 文件大小： | 6024K |
| 代理商： | S29GL032M10BAIR42 |
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February 7, 2007 S29GL-M_00_B8
S29GL-M MirrorBitTM Flash Family
111
Data
Sheet
Revision A2 (February 25, 2004)
Connection Diagrams
Removed the 40-pin reverse TSOP diagram.
Updated the 48-pin standard TSOP diagram.
Removed the 48-pin reverse TSOP diagram.
Removed the 56-pin reverse TSOP diagram.
Ordering Information
Removed all references to package type R.
Autoselect Codes, (High Voltage Method)
Updated the R3, R4 column replacing -04 and -03 designators with -R4 and -R3 respectively.
Word Program Command Sequence
Included statements documenting word programming support for backward compatibility with
existing Flash drivers.
Physical Dimensions
Removed the BGA-80P-M02 diagram.
Revision A3 (February 26, 2004)
Distinctive Characteristics
Corrected typo in the Flexible Sector Architecture section.
Revision A4 (March 24, 2004)
CMOS Compatible
Removed VCC from Max for VOL.
Erase and Program Operations-S29GL256M only
Corrected unit typos.
Erase and Program Operations-S29GL128M only
Corrected the minimum Data Setup Time.
Alternate CE# Controlled Erase and Program Operations-S29GL128M
Corrected the minimum CE# Pulse width.
TSOP Pin and BGA Package Capacitance: Pkg types TB, TC, BB, BC
Added CIN3.
Connection Diagrams
40-pin standard TSOP: Corrected pin 30 to be VIO.
48-pin standard TSOP: Added superscripts to designators for pin 9, 13, 14, 15 and 47. Changed
pin 13 to A21. Added two notes below illustration.
56-pin standard TSOP: Added superscripts to designators for pin 1, 2 and 12. Changed pin 56 to
NC. Added three notes below illustration.
64-ball Fortified BGA: Corrected ball D8 to be VIO. Added superscripts to designators for ball D8,
F7, and F1. Added two notes below illustration.
63-ball Fine-pitch BGA: Added superscript to designator for Ball H7. Added one note below illus-
tration. Added connection diagrams for S29GL064M (model R0) and S29GL032M (model R0).
Pin Description
Added VIO description.
Logic Symbols
Added VIO on all models except R3 and R4.
Figure 3 Write Buffer Programming Operation
Corrected the DQ locations and added callouts to notes one through three.
相关PDF资料 |
PDF描述 |
|---|---|
| S29GL032M10BAIR43 | MirrorBit Flash Family |
| S29GL032M10BFIR42 | MirrorBit Flash Family |
| S29GL032M10BFIR32 | T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 330uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination |
| S29GL032M10BFIR40 | MirrorBit Flash Family |
| S29GL032M10TAIR00 | MirrorBit Flash Family |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S29GL032M10BAIR43 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BAIR50 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR52 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR53 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR60 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
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