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| 型号： | S29GL032M10BAIR42 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 33uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 3528-21; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 3.5mm x 2.8mm x 1.9mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 2,000; Features: Low Temperature |
| 中文描述： | 2M X 16 FLASH 3V PROM, 100 ns, PBGA48 |
| 封装： | 8 X 9 MM, FBGA-48 |
| 文件页数： | 33/116页 |
| 文件大小： | 6024K |
| 代理商： | S29GL032M10BAIR42 |
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February 7, 2007 S29GL-M_00_B8
S29GL-M MirrorBitTM Flash Family
21
Data
Sheet
Ordering Information: S29GL256M
Standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the following:
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits the packing type designator from the ordering part number.
3. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
4. 100% Matte Sn is used for Pb-free TSOP plating.
5. Contact your Spansion representative for availability of the 100 ns speed option.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
This product has been retired and is not recommended for designs. For new and current designs, S29GL256P supersedes S29GL256M, and is the
factory-recommended migration path. Please refer to the S29GL-P Datasheet for specifications and ordering information.
S29GL256M
11
T
A
I
R1
0
PACKING TYPE
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
Model Number
R1
= x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address
sector protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
TEMPERATURE RANGE
I
= Industrial (–40
°C to +85°C)
PACKAGE MATERIAL SET
A= Standard
F= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL256M
256 Megabit Page-Mode Flash Memory Manufactured using 0.23 m MirrorBit
Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 4. S29GL256M Ordering Options
S29GL256M Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL256M
10, 11
TAI,TFI
R1,R2
0,2,3
TSOP
FAI,FFI
LAC064 (3)
Fortified BGA
相关PDF资料 |
PDF描述 |
|---|---|
| S29GL032M10BAIR43 | MirrorBit Flash Family |
| S29GL032M10BFIR42 | MirrorBit Flash Family |
| S29GL032M10BFIR32 | T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 330uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination |
| S29GL032M10BFIR40 | MirrorBit Flash Family |
| S29GL032M10TAIR00 | MirrorBit Flash Family |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S29GL032M10BAIR43 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BAIR50 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR52 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR53 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR60 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
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