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参数资料
| 型号： | S29GL032M10BAIR42 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 33uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 3528-21; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 3.5mm x 2.8mm x 1.9mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 2,000; Features: Low Temperature |
| 中文描述： | 2M X 16 FLASH 3V PROM, 100 ns, PBGA48 |
| 封装： | 8 X 9 MM, FBGA-48 |
| 文件页数： | 31/116页 |
| 文件大小： | 6024K |
| 代理商： | S29GL032M10BAIR42 |
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February 7, 2007 S29GL-M_00_B8
S29GL-M MirrorBitTM Flash Family
19
Data
Sheet
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
Table 2. S29GL064M Ordering Options
S29GL064M Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material, &
Temperature Range
Model
Number
Packing
Type
S29GL064M
90, 10, 11
TAI, TFI
R0,R3,R4,R6,R7
0,2,3
TSOP
R1,R2
TBI, TCI
R2,R7
TAI, TDI
R9
BAI, BFI
R0,R3,R4,R5
FBE063 (4, 6)
Fine-Pitch BGA
FAI, FFI
R1,R2,R3,R4,R5
LAA064 (4)
Fortified BGA
相关PDF资料 |
PDF描述 |
|---|---|
| S29GL032M10BAIR43 | MirrorBit Flash Family |
| S29GL032M10BFIR42 | MirrorBit Flash Family |
| S29GL032M10BFIR32 | T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 330uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination |
| S29GL032M10BFIR40 | MirrorBit Flash Family |
| S29GL032M10TAIR00 | MirrorBit Flash Family |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S29GL032M10BAIR43 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BAIR50 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR52 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR53 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR60 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family |
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