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| 型号： | SC16C654IA68,512 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC68 |
| 封装： | PLASTIC, MS-018, SOT-188-2, LCC-68 |
| 文件页数： | 43/52页 |
| 文件大小： | 647K |
| 代理商： | SC16C654IA68,512 |
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Philips Semiconductors
SC16C654/654D
Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 04 — 19 June 2003
48 of 52
9397 750 11617
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
12. Soldering
12.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for ne pitch SMDs. In
these situations reow soldering is recommended. In these situations reow
soldering is recommended.
12.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 220
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA and SSOP-T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 235
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
12.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C654IB64 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C654IB64,128 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C654IB64,151 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C654IB64,157 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C750 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 64-byte FIFO |
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