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参数资料
| 型号： | SC16C654IA68,512 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC68 |
| 封装： | PLASTIC, MS-018, SOT-188-2, LCC-68 |
| 文件页数： | 44/52页 |
| 文件大小： | 647K |
| 代理商： | SC16C654IA68,512 |
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Philips Semiconductors
SC16C654/654D
Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 04 — 19 June 2003
49 of 52
9397 750 11617
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°C or
265
°C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ux will eliminate the need for removal of corrosive residues in
most applications.
12.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
12.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
Table 29:
Suitability of surface mount IC packages for wave and reow soldering
methods
Package[1]
Soldering method
Wave
Reow[2]
BGA, LBGA, LFBGA, SQFP, SSOP-T[3],
TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[5][6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended[7]
suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C654IB64 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C654IB64,128 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C654IB64,151 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C654IB64,157 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C750 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 64-byte FIFO |
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