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参数资料
| 型号： | SC16C654IA68,512 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC68 |
| 封装： | PLASTIC, MS-018, SOT-188-2, LCC-68 |
| 文件页数： | 46/52页 |
| 文件大小： | 647K |
| 代理商： | SC16C654IA68,512 |
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Philips Semiconductors
SC16C654/654D
Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 04 — 19 June 2003
50 of 52
9397 750 11617
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
13. Revision history
Table 30:
Revision history
Rev Date
CPCN
Description
04
20030619
-
Product data (9397 750 11617); ECN 853-2377 30029 of 16 June 2003.
Modications:
Figure 6 “Crystal oscillator connection.” on page 16: changed capacitors’ values and added
connection with resistor.
Table 27 “DC electrical characteristics” on page 34:ICCsleep: change all values to 1 mA nom.
Table 28 “AC electrical characteristics”: add Table note 2, its reference to parameter ‘IOW
strobe width’, and re-number subsequent note.
03
20030415
-
Product data (9397 750 11373); ECN 853-2377 29798 of 11 April 2003.
02
20030313
-
Product data (9397 750 10985); ECN 853-2377 29458 of 03 February 2003.
01
20020910
-
Product data (9397 750 09393); ECN 853-2377 28891 of 10 September 2002.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C654IB64 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Quad UART with 64-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C654IB64,128 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C654IB64,151 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C654IB64,157 | 功能描述:UART 接口集成电路 16C 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C750 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 64-byte FIFO |
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