参数资料
型号: SI5325C-C-GM
厂商: Silicon Laboratories Inc
文件页数: 55/62页
文件大小: 0K
描述: IC UP-PROG CLK MULTIPLIER 36-QFN
标准包装: 490
系列: DSPLL®
类型: 时钟乘法器
PLL:
输入: 时钟
输出: CML,CMOS,LVDS,LVPECL
电路数: 1
比率 - 输入:输出: 2:2
差分 - 输入:输出: 是/是
频率 - 最大: 346MHz
除法器/乘法器: 是/是
电源电压: 1.71 V ~ 3.63 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 36-VFQFN 裸露焊盘
供应商设备封装: 36-QFN(6x6)
包装: 托盘
Si5325
Rev. 0.5
59
Table 13. PCB Land Pattern Dimensions
Dimension
MIN
MAX
e
0.50 BSC.
E
5.42 REF.
D
5.42 REF.
E2
4.00
4.20
D2
4.00
4.20
GE
4.53
GD
4.53
X
0.28
Y
0.89 REF.
ZE
6.31
ZD
6.31
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 m minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
center ground pad.
Card Assembly
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
Small Body Components.
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