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参数资料
| 型号： | SI7100DN-T1-GE3 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 1/14页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH D-S 8V PPAK 1212-8 |
| 标准包装： | 3,000 |
| 系列： | TrenchFET® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 标准 |
| 漏极至源极电压(Vdss)： | 8V |
| 电流 - 连续漏极(Id) @ 25° C： | 35A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 3.5 毫欧 @ 15A，4.5V |
| Id 时的 Vgs(th)（最大）： | 1V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 105nC @ 8V |
| 输入电容 (Ciss) @ Vds： | 3810pF @ 4V |
| 功率 - 最大： | 52W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | PowerPAK? 1212-8 |
| 供应商设备封装： | PowerPAK? 1212-8 |
| 包装： | 带卷 (TR) |
Si7100DN
Vishay Siliconix
N-Channel 8-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
8
R DS(on) ( Ω )
0.0035 at V GS = 4.5 V
0.0045 at V GS = 2.5 V
I D (A) e
35
35
Q g (Typ.)
40 nC
? Halogen-free Option Available
? TrenchFET ? Power MOSFET
? Low Thermal Resistance PowerPAK ? Package
with Small Size and Low 1.07 mm Profile
RoHS
COMPLIANT
? 100 % R g Tested
PowerPAK 1212- 8
APPLICATIONS
? Secondary Synchronous Rectification
3.30 mm
1
S
S
3.30 mm
? Point-of-Load
2
3
S
G
D
4
D
8
7
D
D
6
D
G
5
Bottom V ie w
S
Orderin g Information: Si7100D N -T1-E3 (Lead (P b )-free)
Si7100D N -T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
8
±8
35 e
Unit
V
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
T C = 25 °C
I D
I DM
I S
35 e
26.1 a, b
20.9 a, b
60
35 e
3.2 a, b
52
A
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
33
3.8 a, b
W
T A = 70 °C
2.4 a, b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) c, d
T J , T stg
- 50 to 150
260
°C
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See Solder Profile ( h ttp://www.vishay.com/ppg?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Package limited.
Document Number: 73785
S-80581-Rev. C, 17-Mar-08
www.vishay.com
1
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