- 您现在的位置：买卖IC网 > PDF目录98083 > SME5410MCZ-270 64-BIT, 270 MHz, RISC PROCESSOR, XMA PDF资料下载
参数资料
| 型号： | SME5410MCZ-270 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 270 MHz, RISC PROCESSOR, XMA |
| 封装： | 130 X 100 MM, 45 MM HEIGHT MODULE |
| 文件页数： | 14/30页 |
| 文件大小： | 183K |
| 代理商： | SME5410MCZ-270 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页当前第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页
21
270 MHz CPU, 256 Kbyte E-cache, UPA, 66 MHz PCI
UltraSPARC-IIi CPU Module
SME5410MCZ-270
July 1998
Sun Microsystems, Inc
THERMAL SPECIFICATIONS AND ANALYSIS
Thermal maps of the UltraSPARC-IIi CPU module indicate that by keeping the CPU device cool, the
SRAMs and clock circuitry on the module are also kept cool.
The operating performance of a CPU device is determined by its junction temperature. The CPU temperature
specication may be provided in terms of its junction or case temperature. This section describes how to esti-
mate the case temperature from the airow condition. It also describes how to measure the case temperature
directly in order to verify the cooling design.
Using the Heatsink Temperature method is the preferred verication method. It is distinctly more accurate
than measurements taken using the Airow Cooling Estimate method. The Case Temperature method is
more difcult to perform, but also yields good results.
In all cases, the junction temperature must not exceed the device specication (typically 105
°C). The lower
the junction temperature, the higher the system reliability.
The following table species the terms, denitions and specications used in order to calculate thermal spec-
ications for the UltraSPARC–IIi CPU device.
Thermal Denitions and Specications
Term
Denition
Specication
Tj
Device junction temperature
Can't be measured directly, must always be
estimated at less than 105
°C, lower is
preferred.
Tc
Case temperature
Measurable at the top-center of the device.
Requires a hole in the base of the heatsink to
allow the thermocouple to be in contact with
the case.
Ts
Heatsink temperature
Measurable as the temperature of the base of
the heatsink. Best approach is to embed a
thermocouple in a cavity drilled in the heat-
sink base. An alternative is to place the
thermocouple down between the ns/pins of
the heatsink (insulated from the airow) and
in contact with the base plate of the heatsink.
Ta
Module ambient air temperature
Air temperature as it approaches the heatsink.
Pd
Power dissipation of the CPU
8 watts for the UltraSPARC–IIi 270 MHz CPU
θjc
Junction-to-case thermal resistance of the
package
This value is approximately 0.5
°C/W
θcs
Case-to-heatsink thermal resistance
This value is approximately 0.1
°C/W when
good thermal grease contact is made between
the package and the heatsink.
θsa
Heatsink-to-air thermal resistance
This value is dependent on the heatsink
design, the airow direction, and the airow
velocity. (see Table 2)
Airow
Free Stream Airow
Unchanneled airow velocity approaching
the heatsink.
相关PDF资料 |
PDF描述 |
|---|---|
| SME5434PCI-440 | 64-BIT, 440 MHz, RISC PROCESSOR, XMA |
| SME5434PCI-480 | 64-BIT, 480 MHz, RISC PROCESSOR, XMA |
| SMFR-29C516ESC | 16-BIT ERROR DETECT AND CORRECT CKT, QFP100 |
| SMJ320C26FJ | 16-BIT, 40 MHz, OTHER DSP, CQCC68 |
| SMJ320C31KGDM40B | 32-BIT, 40 MHz, OTHER DSP, UUC132 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S-ME6 | 制造商:Phoenix Contact 功能描述:Lock, switching, ME terminal |
| SME6.3T471M8X16LL | 制造商:Texas Instruments 功能描述:EA471-6R3M85 |
| SME6.3VB101M6X11LL | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MINIATURE, GENERAL PURPOSE, SOLVENT PROOF |
| SME6.3VB102M10X12LL | 制造商:United Chemi-Con Inc 功能描述:Capacitor, Aluminium, 1mf, 6.3V, 20±% |
| SME6.3VB103M16X31LL | 功能描述:铝质电解电容器 - 带引线 10KuF 6.3V RoHS:否 制造商:Kemet 引线类型: 电容:220 uF 容差:20 % 电压额定值:25 V 工作温度范围: 端接类型:Radial 外壳直径:8 mm 外壳长度:11 mm 引线间隔:5 mm 产品:General Purpose Electrolytic Capacitors 封装:Bulk |
发布紧急采购，3分钟左右您将得到回复。