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参数资料
型号： ST10F269Z2Q3
厂商： STMICROELECTRONICS
元件分类： 微控制器/微处理器
英文描述： 16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP144
封装： 28 X 28 MM, PLASTIC, QFP-144
文件页数： 15/160页
文件大小： 1541K
代理商： ST10F269Z2Q3
ST10F269
111/160
Unlike hardware and software resets, the watchdog reset completes a running external bus cycle if this
bus cycle either does not use READY, or if READY is sampled active (low) after the programmed wait
states. When READY is sampled inactive (high) after the programmed wait states the running external
bus cycle is aborted. Then the internal reset sequence (1024 TCL) is started. The microcontroller
behaviour is the same as for a short hardware reset, except that only P0.12...P0.6 bits are latched, while
previously latched values of P0.5...P0.2 are cleared.
18.5 - RSTOUT, RSTIN, Bidirectional Reset
18.5.1 - RSTOUT Pin
The RSTOUT pin is driven active (low level) at the beginning of any reset sequence (synchronous/
asynchronous hardware, software and watchdog timer resets). RSTOUT pin stays active low beyond the
end of the initialization routine, until the protected EINIT instruction (End of Initialization) is completed.
18.5.2 - Bidirectional Reset
The bidirectional reset function is enabled by setting SYSCON.BDRSTEN (bit 3). This function is disabled
by any reset sequence which always clears the SYSCON.BDRSTEN bit.
It can only be enabled during the initialisation routine, before EINIT instruction is completed.
If VRPD voltage drops below the RPD pin threshold (typically 2.5V for VDD = 5V) when RSTIN pin is low or
when RSTIN pin is internally pulled low, the ST10 reset circuitry disables the bidirectional reset function
and RSTIN pin is no more pulled low. The reset is processed as an asynchronous reset.
The bidirectional reset function is useful for external peripherals with on-chip memory because the reset
signal output on RSTIN pin is de-activated before the CPU starts its first instruction fetch.
18.5.3 - RSTIN pin
When the bidirectional reset function is enabled, the open-drain of the RSTIN pin is activated, pulling
down the reset signal, for the duration of the internal reset sequence. See Figure 56 and Figure 57. At the
end of the sequence the pull-down is released and the RSTIN pin gets back its input function.
The bidirectional reset function can be used:
– to convert SW or WD resets to a hardware reset so that the configuration can be (re-)latched from
PORT0.
– to make visible SW or WDT resets at RSTIN pin whenever RSTIN is the only reset signal used by the
application (RSTOUT not used).
– to get a de-activated reset signal before CPU starts its first instruction fetch.
The configuration latched from PORT0 is determined by the kind of reset generated by the application.
(Refer to Table 29).
Converting a SW or WDT reset to a hardware reset allows the PLL to re-lock or the PLL configuration to
be re-latched, provided a SW or WDT reset is generated by the application program is case of PLL unlock
or input clock fail.
18.6 - Reset Circuitry
The internal reset circuitry is described in Figure 58.
An internal pull-up resistor is implemented on RSTIN pin. (50k
minimum, to 250k maximum). The
minimum reset time must be calculated using the lowest value. In addition, a programmable pull-down
(SYSCON.BDRSTEN bit 3) drives the RSTIN pin according to the internal reset state. The RSTOUT pin
provides a signals to the application. (Refer to Section 18.5 - RSTOUT, RSTIN, Bidirectional Reset).
A weak internal pull-down is connected to the RPD pin to discharge external capacitor to VSS at a rate of
100
A to 200A. This Pull-down is turned on when RSTIN pin is low
If bit PWDCFG of SYSCON register is set, an internal pull-up resistor is activated at the end of the reset
sequence. This pull-up charges the capacitor connected to RPD pin.
If the bidirectional reset function is not used, the simplest way to reset ST10F269 is to connect external
components as shown in Figure 59. It works with reset from application (hardware or manual) and with
power-on. The value of C1 capacitor, connected on RSTIN pin with internal pull-up resistor (50k
to
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相关代理商/技术参数
参数描述
ST10F269Z2Q6 功能描述:16位微控制器 - MCU 256K Flash 12K RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269Z2Q6/TR 功能描述:16位微控制器 - MCU 16B MCU 256K Byte and 12K Byte RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269Z2QX 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:16-BIT MCU WITH MAC UNIT, 256K BYTE FLASH MEMORY AND 12K BYTE RAM
ST10F269Z2T3 功能描述:16位微控制器 - MCU ST10F272 16B MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269Z2T6 功能描述:16位微控制器 - MCU ST10F272 16B MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
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