参数资料
型号: ST10F269Z2Q3
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP144
封装: 28 X 28 MM, PLASTIC, QFP-144
文件页数: 89/160页
文件大小: 1541K
代理商: ST10F269Z2Q3
ST10F269
34/160
6 - CENTRAL PROCESSING UNIT (CPU)
The CPU includes a 4-stage instruction pipeline, a
16-bit arithmetic and logic unit (ALU) and dedi-
cated SFRs. Additional hardware has been added
for a separate multiply and divide unit, a bit-mask
generator and a barrel shifter.
Most of the ST10F269’s instructions can be exe-
cuted in one instruction cycle which requires 50ns
at 40MHz CPU clock. For example, shift and
rotate instructions are processed in one instruc-
tion cycle independent of the number of bits to be
shifted.
Multiple-cycle instructions have been optimized:
branches are carried out in 2 cycles, 16 x 16-bit
multiplication in 5 cycles and a 32/16-bit division
in 10 cycles.
The jump cache reduces the execution time of
repeatedly performed jumps in a loop, from
2 cycles to 1 cycle.
The CPU uses a bank of 16 word registers to run
the current context. This bank of General Purpose
Registers (GPR) is physically stored within the
on-chip Internal RAM (IRAM) area. A Context
Pointer
(CP)
register
determines
the
base
address of the active register bank to be accessed
by the CPU.
The number of register banks is only restricted by
the available Internal RAM space. For easy
parameter passing, a register bank may overlap
others.
A system stack of up to 1024 bytes is provided as
a storage for temporary data. The system stack is
allocated in the on-chip RAM area, and it is
accessed by the CPU via the stack pointer (SP)
register.
Two separate SFRs, STKOV and STKUN, are
implicitly compared against the stack pointer
value upon each stack access for the detection of
a stack overflow or underflow.
Figure 9 : CPU Block Diagram (MAC Unit not included)
32
Internal
RAM
2K Byte
General
Purpose
Registers
R0
R15
MDH
MDL
Barrel-Shift
Mul./Div.-HW
Bit-Mask Gen.
ALU
16-Bit
CP
SP
STKOV
STKUN
Exec. Unit
Instr. Ptr
4-Stage
Pipeline
PSW
SYSCON
BUSCON 0
BUSCON 1
BUSCON 2
BUSCON 3
BUSCON 4
ADDRSEL 1
ADDRSEL 2
ADDRSEL 3
ADDRSEL 4
Data Pg. Ptrs
Code Seg. Ptr.
CPU
256K Byte
Flash
memory
16
Bank
n
Bank
i
Bank
0
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相关代理商/技术参数
参数描述
ST10F269Z2Q6 功能描述:16位微控制器 - MCU 256K Flash 12K RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269Z2Q6/TR 功能描述:16位微控制器 - MCU 16B MCU 256K Byte and 12K Byte RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269Z2QX 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:16-BIT MCU WITH MAC UNIT, 256K BYTE FLASH MEMORY AND 12K BYTE RAM
ST10F269Z2T3 功能描述:16位微控制器 - MCU ST10F272 16B MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269Z2T6 功能描述:16位微控制器 - MCU ST10F272 16B MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT