参数资料
型号: ST72324K6B3/XXX
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 8-BIT, MROM, 8 MHz, MICROCONTROLLER, PDIP32
封装: 0.400 INCH, SHRINK, PLASTIC, DIP-32
文件页数: 38/157页
文件大小: 1037K
代理商: ST72324K6B3/XXX
ST72324J/K
132/157
EMC CHARACTERISTICS (Cont’d)
12.7.4 ESD Pin Protection Strategy
To protect an integrated circuit against Electro-
Static Discharge the stress must be controlled to
prevent degradation or destruction of the circuit el-
ements. The stress generally affects the circuit el-
ements which are connected to the pads but can
also affect the internal devices when the supply
pads receive the stress. The elements to be pro-
tected must not receive excessive current, voltage
or heating within their structure.
An ESD network combines the different input and
output ESD protections. This network works, by al-
lowing safe discharge paths for the pins subjected
to ESD stress. Two critical ESD stress cases are
presented in Figure 75 and Figure 76 for standard
pins and in Figure 77 and Figure 78 for true open
drain pins.
Standard Pin Protection
To protect the output structure the following ele-
ments are added:
– A diode to VDD (3a) and a diode from VSS (3b)
– A protection device between VDD and VSS (4)
To protect the input structure the following ele-
ments are added:
– A resistor in series with the pad (1)
– A diode to VDD (2a) and a diode from VSS (2b)
– A protection device between VDD and VSS (4)
Figure 75. Positive Stress on a Standard Pad vs. VSS
Figure 76. Negative Stress on a Standard Pad vs. VDD
IN
VDD
VSS
(1)
(2a)
(2b)
(4)
OUT
VDD
VSS
(3a)
(3b)
Main path
Path to avoid
IN
VDD
VSS
(1)
(2a)
(2b)
(4)
OUT
VDD
VSS
(3a)
(3b)
Main path
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