参数资料
型号: UDA1342TSDB-T
厂商: NXP SEMICONDUCTORS
元件分类: 消费家电
英文描述: Audio CODEC
中文描述: SPECIALTY CONSUMER CIRCUIT, PDSO28
封装: 5.30 MM, ROHS COMPLIANT, PLASTIC, MO-150, SSOP-28
文件页数: 12/48页
文件大小: 304K
代理商: UDA1342TSDB-T
2000 Jul 31
2
Philips Semiconductors
Product specication
Audio CODEC
UDA1342TS
CONTENTS
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
System clock
8.2
ADC analog front-end
8.2.1
Application with 2 V (RMS) input
8.2.2
Double differential mode
8.3
Decimation filter (ADC)
8.4
Digital mixer (ADC)
8.5
Interpolation filter (DAC)
8.6
Mute
8.7
Digital mixer (DAC)
8.8
Noise shaper
8.9
Filter stream DAC
8.10
Digital interface
8.11
Sampling speed
8.12
Power-on reset
8.13
Control modes
8.14
Static pin mode
8.14.1
System clock setting select
8.14.2
Digital interface format select
8.14.3
ADC input channel select
8.15
L3-bus interface
8.15.1
Introduction
8.15.2
Device addressing
8.15.3
Register addressing
8.15.4
Data write mode
8.15.5
Data read mode
8.16
I2C-bus interface
8.16.1
Addressing
8.16.2
Slave address
8.16.3
Register address
8.16.4
Write cycle
8.16.5
Read cycle
9
REGISTER MAPPING
9.1
Reset
9.2
Quick mode switch
9.3
Bypass mixer DC filter
9.4
DC filter
9.5
ADC mode
9.6
ADC polarity
9.7
System clock frequency
9.8
Data format
9.9
DAC power control
9.10
Input oversampling rate
9.11
DAC polarity
9.12
DAC mixing position switch
9.13
DAC mixer
9.14
Silence detection period
9.15
Multi purpose output
9.16
Mode
9.17
Bass boost
9.18
Treble
9.19
Silence detector switch
9.20
Mute
9.21
Quick mute mode
9.22
De-emphasis
9.23
ADC input amplifier gain
9.24
DAC volume control
9.25
DAC mixer volume control
9.26
ADC mixer gain control
10
LIMITING VALUES
11
HANDLING
12
QUALITY SPECIFICATION
13
THERMAL CHARACTERISTICS
14
DC CHARACTERISTICS
15
AC CHARACTERISTICS
16
TIMING
17
APPLICATION INFORMATION
18
PACKAGE OUTLINE
19
SOLDERING
19.1
Introduction to soldering surface mount
packages
19.2
Reflow soldering
19.3
Wave soldering
19.4
Manual soldering
19.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
20
DATA SHEET STATUS
21
DEFINITIONS
22
DISCLAIMERS
23
PURCHASE OF PHILIPS I2C COMPONENTS
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