- 您现在的位置：买卖IC网 > PDF目录199556 > UDA1342TSDB-T (NXP SEMICONDUCTORS) Audio CODEC PDF资料下载
参数资料
| 型号： | UDA1342TSDB-T |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 消费家电 |
| 英文描述： | Audio CODEC |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
| 封装： | 5.30 MM, ROHS COMPLIANT, PLASTIC, MO-150, SSOP-28 |
| 文件页数： | 35/48页 |
| 文件大小： | 304K |
| 代理商： | UDA1342TSDB-T |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页当前第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页
2000 Jul 31
40
Philips Semiconductors
Product specication
Audio CODEC
UDA1342TS
19.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| UDA1342TS/N1,512 | Audio CODEC; Package: SOT341-1 (SSOP28); Container: Tube Dry Pack |
| UDA1342TS/N1,518 | Audio CODEC; Package: SOT341-1 (SSOP28); Container: Reel Dry Pack, SMD, 13" |
| UDA1345TS/N2,118 | Economy audio CODEC; Package: SOT341-1 (SSOP28); Container: Reel Pack, SMD, 13" |
| UDA1345TS/N2,112 | Economy audio CODEC; Package: SOT341-1 (SSOP28); Container: Tube |
| UDA1361TS/N1,112 | 96 kHz sampling 24-bit stereo audio ADC; Package: SOT369-1 (SSOP16); Container: Tube |
相关代理商/技术参数 |
参数描述 |
|---|---|
| UDA1343 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Economy audio CODEC with features |
| UDA1343TT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Economy audio CODEC with features |
| UDA1344 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-voltage low-power stereo audio CODEC with DSP features |
| UDA1344TS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-voltage low-power stereo audio CODEC with DSP features |
| UDA1344TS/N2 | 制造商:NXP Semiconductors 功能描述:IC CODEC AUDIO W/DSP 28-SSOP 制造商:NXP Semiconductors 功能描述:IC, CODEC, AUDIO, W/DSP, 28-SSOP |
发布紧急采购，3分钟左右您将得到回复。