参数资料
| 型号： | W25Q40BWSNIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/73页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 4MBIT 8SOIC |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 4M (512K x 8) |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 1.65 V ~ 1.95 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q40BW
Table of Contents
1.
2.
3.
4.
5.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES ....................................................................................................................................... 5
PIN CONFIGURATION SOIC/VSOP 150-MIL ................................................................................. 6
PAD CONFIGURATION WSON 6X5-MM, USON 2X3-MM ............................................................. 6
PIN DESCRIPTION SOIC/VSOP 150-MIL, WSON 6X5-MM & USON 2X3-MM ............................. 6
5.1
5.2
5.3
5.4
5.5
5.6
Package Types ..................................................................................................................... 7
Chip Select (/CS) .................................................................................................................. 7
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 7
Write Protect (/WP)............................................................................................................... 7
HOLD (/HOLD) ..................................................................................................................... 7
Serial Clock (CLK) ................................................................................................................ 7
6.
7.
BLOCK DIAGRAM ............................................................................................................................ 8
FUNCTIONAL DESCRIPTION ......................................................................................................... 9
7.1
SPI OPERATIONS ............................................................................................................... 9
7.1.1
7.1.2
7.1.3
7.1.4
Standard SPI Instructions ....................................................................................................... 9
Dual SPI Instructions .............................................................................................................. 9
Quad SPI Instructions ............................................................................................................ 9
Hold Function ......................................................................................................................... 9
7.2
WRITE PROTECTION ....................................................................................................... 10
7.2.1
Write Protect Features ......................................................................................................... 10
8.
CONTROL AND STATUS REGISTERS ........................................................................................ 11
8.1
STATUS REGISTER .......................................................................................................... 11
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
8.1.8
8.1.9
8.1.10
8.1.11
8.1.12
BUSY ................................................................................................................................... 11
Write Enable Latch (WEL) .................................................................................................... 11
Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 11
Top/Bottom Block Protect (TB) ............................................................................................. 11
Sector/Block Protect (SEC) .................................................................................................. 11
Complement Protect (CMP) ................................................................................................. 12
Status Register Protect (SRP1, SRP0) ................................................................................ 12
Erase/Program Suspend Status (SUS) ................................................................................ 12
Security Register Lock Bits (LB3, LB2, LB1, LB0) ................................................................ 12
Quad Enable (QE) .............................................................................................................. 13
Status Register Memory Protection (CMP = 0)................................................................... 14
Status Register Memory Protection (CMP = 1)................................................................... 15
8.2
INSTRUCTIONS................................................................................................................. 16
8.2.1
8.2.2
Manufacturer and Device Identification ................................................................................ 16
Instruction Set Table 1 (Erase, Program Instructions) (1) ....................................................... 17
-2-
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q40BWSNIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 4MBIT 80MHZ 8SOIC |
| W25Q40BWSNIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q40BWSSIG | 功能描述:IC FLASH SPI 4MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25Q40BWSSIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 4MBIT 80MHZ 8SOIC |
| W25Q40BWUXIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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