参数资料
| 型号： | W25Q40BWSNIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 73/73页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 4MBIT 8SOIC |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 4M (512K x 8) |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 1.65 V ~ 1.95 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q40BW
11. REVISION HISTORY
VERSION
A
B
C
D
E
F
DATE
01/27/11
06/13/11
12/21/11
07/24/12
05/02/13
10/11/13
PAGE
5-6, 65, 69-70
All
6, 68
58
63
61
64-71
4-5,68-71
4-6,68-71
DESCRIPTION
New Create Preliminary
Added VSOP-8 package
Removed Preliminary designator
Updated package diagrams
Added power-down requirement
Updated timing drawings
Updated Vcc rage
Removed W25Q40BWxxIP
Added USON 2x3x0.6mm 3 package information
Added SOIC-8 208mil package information
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation .
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur. Winbond customers using or
selling these products for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document
and the products and services described herein at any time, without notice.
Publication Release Date: October 11, 2013
- 73 -
Revision F
相关PDF资料 |
PDF描述 |
|---|---|
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| AX1000-FG896I | IC FPGA AXCELERATOR 1M 896-FBGA |
| W25Q16BVZPIG | IC SPI FLASH 16MBIT 8WSON |
| W25Q80BVDAIG | SPI FLASH 8MBIT 8-DIP |
| EP1S10F780C6N | IC STRATIX FPGA 10K LE 780-FBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q40BWSNIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 4MBIT 80MHZ 8SOIC |
| W25Q40BWSNIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q40BWSSIG | 功能描述:IC FLASH SPI 4MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25Q40BWSSIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 4MBIT 80MHZ 8SOIC |
| W25Q40BWUXIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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