参数资料
| 型号： | W25Q80BWSNIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/74页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 8MBIT 8SOIC |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 8M（1M x 8） |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 1.65 V ~ 1.95 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q80BW
Table of Contents
1.
2.
3.
GENERAL DESCRIPTIONS............................................................................................................. 5
FEATURES ....................................................................................................................................... 5
PACKAGE TYPES ............................................................................................................................ 6
3.1
3.2
3.3
3.4
3.5
Pin Configuration SOIC / VSOP 150 / 208-mil ..................................................................... 6
PAD Configuration WSON 6x5-mm ..................................................................................... 6
Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm ............................................... 6
Ball Configuration WLBGA ................................................................................................... 7
Ball Description WLBGA ...................................................................................................... 7
4.
PIN DESCRIPTIONS ........................................................................................................................ 8
4.1
4.2
4.3
4.4
4.5
Chip Select (/CS) .................................................................................................................. 8
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8
Write Protect (/WP)............................................................................................................... 8
HOLD (/HOLD) ..................................................................................................................... 8
Serial Clock (CLK) ................................................................................................................ 8
5.
6.
BLOCK DIAGRAM ............................................................................................................................ 9
FUNCTIONAL DESCRIPTION ....................................................................................................... 10
6.1
SPI OPERATIONS ............................................................................................................. 10
6.1.1
6.1.2
6.1.3
6.1.4
Standard SPI Instructions ..................................................................................................... 10
Dual SPI Instructions ............................................................................................................ 10
Quad SPI Instructions ........................................................................................................... 10
Hold Function........................................................................................................................ 10
6.2
WRITE PROTECTION ....................................................................................................... 11
6.2.1
Write Protect Features .......................................................................................................... 11
7.
STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 12
7.1
STATUS REGISTERs ........................................................................................................ 12
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
7.1.10
7.1.11
7.1.12
BUSY Status (BUSY) ............................................................................................................ 12
Write Enable Latch Status (WEL) ......................................................................................... 12
Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 12
Top/Bottom Block Protect (TB) ............................................................................................. 12
Sector/Block Protect (SEC)................................................................................................... 12
Complement Protect (CMP) .................................................................................................. 13
Status Register Protect (SRP1, SRP0) ................................................................................. 13
Erase/Program Suspend Status (SUS) ................................................................................. 13
Security Register Lock Bits (LB3, LB2, LB1, LB0) ................................................................ 13
Quad Enable (QE) .............................................................................................................. 14
Status Register Memory Protection (CMP = 0) ................................................................... 15
Status Register Memory Protection (CMP = 1) ................................................................... 16
-2-
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q80BWSNIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BWSSIG | 功能描述:IC FLASH SPI 8MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25Q80BWSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BWUXIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BWUXIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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