参数资料
型号: W25Q80BWSNIG
厂商: Winbond Electronics
文件页数: 4/74页
文件大小: 0K
描述: IC FLASH SPI 8MBIT 8SOIC
标准包装: 100
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 8M(1M x 8)
速度: 80MHz
接口: SPI 串行
电源电压: 1.65 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q80BW
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
Absolute Maximum Ratings................................................................................................ 58
Operating Ranges .............................................................................................................. 58
Power-up Timing and Write Inhibit Threshold .................................................................... 59
DC Electrical Characteristics .............................................................................................. 60
AC Measurement Conditions ............................................................................................. 61
AC Electrical Characteristics .............................................................................................. 62
AC Electrical Characteristics (cont’d) ................................................................................. 63
Serial Output Timing ........................................................................................................... 64
Serial Input Timing.............................................................................................................. 64
HOLD Timing ...................................................................................................................... 64
WP Timing .......................................................................................................................... 64
9.
PACKAGE SPECIFICATION .......................................................................................................... 65
9.1
9.2
9.3
9.4
9.5
9.6
8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 65
8-Pin VSOP 150-mil (Package Code SV) .......................................................................... 66
8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 67
8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 68
8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 69
8-Ball WLBGA (Package Code BY) ................................................................................... 71
10.
ORDERING INFORMATION .......................................................................................................... 72
10.1
Valid Part Numbers and Top Side Marking ........................................................................ 73
11.
REVISION HISTORY ...................................................................................................................... 74
-4-
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