参数资料
型号: W25Q80BWSNIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 3.81 MM, GREEN, PLASTIC, SOIC-8
文件页数: 69/71页
文件大小: 0K
代理商: W25Q80BWSNIP
W25Q80BW
Publication Release Date: January 26, 2011
- 71 -
Preliminary - Revision A
12. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
01/26/10
New Create Preliminary
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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