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参数资料
| 型号： | W25X10BVZPIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/51页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 1MBIT 8WSON |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 1M (128K x 8) |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-WDFN 裸露焊盘 |
| 供应商设备封装： | 8-WSON（6x5） |
| 包装： | 管件 |
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W25X10BV/20BV/40BV
Table of Contents
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATION SOIC 150-MIL / 208-MIL ...................................................................... 5
PAD CONFIGURATION WSON 6X5-MM .................................................................................. 5
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5-MM ............................... 6
6.1
6.2
6.3
6.4
6.5
6.6
Package Types ............................................................................................................... 7
Chip Select (/CS) ............................................................................................................ 7
Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 7
Write Protect (/WP) ......................................................................................................... 7
HOLD (/HOLD) ............................................................................................................... 7
Serial Clock (CLK) .......................................................................................................... 7
7.
8.
BLOCK DIAGRAM ...................................................................................................................... 8
FUNCTIONAL DESCRIPTION ................................................................................................... 9
8.1
SPI OPERATIONS ......................................................................................................... 9
8.1.1
8.1.2
8.1.3
Standard SPI Instructions .................................................................................................9
Dual SPI Instructions ........................................................................................................9
Hold Function ...................................................................................................................9
8.2
WRITE PROTECTION .................................................................................................. 10
8.2.1
Write Protect Features ....................................................................................................10
9.
CONTROL AND STATUS REGISTERS ................................................................................... 11
9.1
STATUS REGISTER .................................................................................................... 11
9.1.1
9.1.2
9.1.3
9.1.4
9.1.5
9.1.6
9.1.7
BUSY ..............................................................................................................................11
Write Enable Latch (WEL) ..............................................................................................11
Block Protect Bits (BP2, BP1, BP0) ................................................................................11
Top/Bottom Block Protect (TB) .......................................................................................11
Reserved Bits .................................................................................................................11
Status Register Protect (SRP) ........................................................................................12
Status Register Memory Protection ................................................................................13
9.2
INSTRUCTIONS ........................................................................................................... 14
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.2.6
9.2.7
9.2.8
Manufacturer and Device Identification ..........................................................................14
Instruction Set ................................................................................................................15
Write Enable (06h) ..........................................................................................................16
Write Disable (04h) .........................................................................................................16
Read Status Register (05h) ............................................................................................17
Write Status Register (01h) ............................................................................................18
Read Data (03h) .............................................................................................................19
Fast Read (0Bh) .............................................................................................................20
-2-
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X10CLSNIG | 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 2.5V/3.3V 1Mbit 128K/64K x 8bit/16bit 8ns 8-Pin SOIC 制造商:Winbond Electronics Corp 功能描述:IC FLASH 1MBIT 104MHZ 8SOIC |
| W25X10CLSNIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 1M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC MEMORY |
| W25X10CLZPIG | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 1MBIT 104MHZ 8WSON |
| W25X10CLZPIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 1MBIT 104MHZ 8WSON |
| W25X10L | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
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