参数资料
型号: W25X10BVZPIG
厂商: Winbond Electronics
文件页数: 3/51页
文件大小: 0K
描述: IC SPI FLASH 1MBIT 8WSON
标准包装: 100
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 1M (128K x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WSON(6x5)
包装: 管件
W25X10BV/20BV/40BV
9.2.9
9.2.10
9.2.11
9.2.12
9.2.13
9.2.14
9.2.15
9.2.16
9.2.17
9.2.18
9.2.19
9.2.20
9.2.21
9.2.22
9.2.23
Fast Read Dual Output (3Bh) .........................................................................................21
Fast Read Dual I/O (BBh) .............................................................................................22
Continuous Read Mode Bits (M7-0) .............................................................................24
Continuous Read Mode Reset (FFFFh) .......................................................................24
Page Program (02h) .....................................................................................................25
Sector Erase (20h) .......................................................................................................26
32KB Block Erase (52h) ...............................................................................................27
Block Erase (D8h) ........................................................................................................28
Chip Erase (C7h or 60h) ...............................................................................................29
Power-down (B9h) ........................................................................................................30
Release Power-down / Device ID (ABh) .......................................................................31
Read Manufacturer / Device ID (90h) ...........................................................................33
Read Manufacturer / Device ID Dual I/O (92h) .............................................................34
Read Unique ID Number (4Bh) .....................................................................................35
JEDEC ID (9Fh) ...........................................................................................................36
10.
ELECTRICAL CHARACTERISTICS ......................................................................................... 37
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10
Absolute Maximum Ratings .......................................................................................... 37
Operating Ranges ......................................................................................................... 37
Power-up Timing and Write Inhibit Threshold .............................................................. 38
DC Electrical Characteristics ........................................................................................ 39
AC Measurement Conditions ........................................................................................ 40
AC Electrical Characteristics ........................................................................................ 41
AC Electrical Characteristics (cont’d) ........................................................................... 42
Serial Output Timing ..................................................................................................... 43
Input Timing .................................................................................................................. 43
Hold Timing ................................................................................................................. 43
11.
PACKAGE SPECIFICATION .................................................................................................... 44
11.1
11.2
11.3
11.4
8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 44
8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 45
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 46
8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 47
12.
ORDERING INFORMATION .................................................................................................... 49
12.1
Valid Part Numbers and Top Side Marking .................................................................. 50
REVISION HISTORY ............................................................................................................................ 51
Publication Release Date: August 20, 2009
-3-
Preliminary -- Revision B
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