参数资料
型号: W25X10BVZPIG
厂商: Winbond Electronics
文件页数: 44/51页
文件大小: 0K
描述: IC SPI FLASH 1MBIT 8WSON
标准包装: 100
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 1M (128K x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WSON(6x5)
包装: 管件

W25X10BV/20BV/40BV
11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 150-mil (Package Code SN)
8
? 1
5
4
E
H E
c
L
Y
D
A
0.25
O
SEATING PLANE
b
SYMBOL
e
A1
MILLIMETERS
Min Max
INCHES
Min Max
GAUGE PLANE
A
A1
b
1.35
0.10
0.33
1.75
0.25
0.51
0.053
0.004
0.013
0.069
0.010
0.020
c
E (3)
D (3)
e (2)
0.19
3.80
4.80
1.27 BSC
0.25
4.00
5.00
0.008 0.010
0.150 0.157
0.188 0.196
0.050 BSC
H E
Y (4)
L
?
5.80
-
0.40
6.20
0.10
1.27
10°
0.228
-
0.016
0.244
0.004
0.050
10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches .
- 44 -
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