参数资料
型号: W29GL128CH9B
厂商: Winbond Electronics
文件页数: 4/67页
文件大小: 0K
描述: IC FLASH 128MBIT 90NS 64LFBGA
标准包装: 171
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 128M(16M x 8,8M x 16)
速度: 90ns
接口: 并联
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 64-LBGA
供应商设备封装: 64-LFBGA(11x13)
包装: 管件
W29GL128C
8.1
8.2
8.3
8.4
Absolute Maximum Stress Ratings ............................................................................... 29
Operating Temperature and Voltage ............................................................................ 29
DC Characteristics ........................................................................................................ 30
Switching Test Circuits.................................................................................................. 31
8.4.1
Switching Test Waveform ............................................................................................... 31
8.5
AC Characteristics ........................................................................................................ 32
8.5.1
8.5.2
8.5.3
8.5.4
8.5.5
8.5.6
8.5.7
Instruction Write Operation ............................................................................................. 33
Read / Reset Operation .................................................................................................. 34
Erase/Program Operation ............................................................................................... 36
Write Operation Status .................................................................................................... 46
WORD/BYTE CONFIGURATION (#BYTE)..................................................................... 50
DEEP POWER DOWN MODE........................................................................................ 52
WRITE BUFFER PROGRAM.......................................................................................... 52
8.6
Recommended Operating Conditions........................................................................... 53
8.6.1
At Device Power-up ........................................................................................................ 53
8.7
8.8
8.9
8.10
Erase and Programming Performance ......................................................................... 54
Data Retention .............................................................................................................. 54
Latch-up Characteristics ............................................................................................... 54
Pin Capacitance ............................................................................................................ 54
9
PACKAGE DIMENSIONS ......................................................................................................... 55
9.1
9.2
9.3
TSOP 56-pin 14x20mm ................................................................................................ 55
Thin & Fine-Pitch Ball Grid Array, 56 ball, 7x9mm (TFBGA56) .................................... 56
Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBA64) ............................ 57
10
ORDERING INFORMATION..................................................................................................... 58
10.1
10.2
Ordering Part Number Definitions................................................................................. 58
Valid Part Numbers and Top Side Marking .................................................................. 59
11
HISTORY .................................................................................................................................. 60
ii
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